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arXiv 1408.0358cond-mat.mtrl-sciphysics.optics
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高温器件材料石墨烯的本征载流子密度、载流子漂移速度和晶格能

Graphene, a material for high temperature devices; intrinsic carrier density, carrier drift velocity, and lattice energy

Yan Yin, Zengguang Cheng, Li Wang, Kuijuan Jin, Wenzhong Wang

摘要:

对于传统的半导体机器来说,热量一直是一个致命的问题。主要的物理原因是,由传统半导体材料制成的器件的固有载流子密度随着温度的升高而非常快地增加。一旦达到某一温度,密度超过化学掺杂或门控效应,任何由半导体制成的pn结或晶体管将无法工作。在这里,我们测量了石墨烯器件的本征费米能级(|E_F| = 2.93 k_B *T)或本征载流子密度(n_in=3.87*10^6 cm^-2 K^-2*T^2)、载流子漂移速度和G模声子能量以及它们在2400 K以下的温度依赖性。结果表明,石墨烯的本征载流子密度对温度的敏感性比Si和Ge低一个数量级,揭示了石墨烯作为高温器件材料的巨大潜力。我们还观察到饱和漂移速度随温度的升高而线性下降,并确定了本征G模声子能量的温度系数。以上知识对于理解石墨烯在高功率或高温下的物理现象至关重要。

英文摘要:

Heat has always been a killing matter for traditional semiconductor machines. The underlining physical reason is that the intrinsic carrier density of a device made from a traditional semiconductor material increases very fast with a rising temperature. Once reaching a temperature, the density surpasses the chemical doping or gating effect, any p-n junction or transistor made from the semiconductor will fail to function. Here, we measure the intrinsic Fermi level (|E_F|=2.93k_B*T) or intrinsic carrier density (n_in=3.87*10^6 cm^-2 K^-2*T^2), carrier drift velocity, and G mode phonon energy of graphene devices and their temperature dependencies up to 2400 K. Our results show intrinsic carrier density of graphene is an order of magnitude less sensitive to temperature than those of Si or Ge, and reveal the great potentials of graphene as a material for high temperature devices. We also observe a linear decline of saturation drift velocity with increasing temperature, and identify the temperature coefficients of the intrinsic G mode phonon energy. Above knowledge is vital in understanding the physical phenomena of graphene under high power or high temperature.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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