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arXiv 0905.4409cond-mat.mes-hallcond-mat.mtrl-sci
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用氦离子束刻蚀石墨烯器件

Etching of Graphene Devices with a Helium Ion Beam

M. C. Lemme, D. C. Bell, J. R. Williams, L. A. Stern, B. W. H. Baugher, P. Jarillo-Herrero, C. M. Marcus

摘要:

我们报告了用氦离子束刻蚀石墨烯器件,包括光刻过程中的原位电学测量。蚀刻工艺可用于纳米结构化和电隔离石墨烯器件中的不同区域,如通过蚀刻悬浮石墨烯器件中的通道所证明的,其中蚀刻间隙低至约10 nm。二氧化硅(SiO2)基板上的石墨烯器件蚀刻与较低的He离子剂量,并被发现有蚀刻后,我们归因于碳氢化合物的污染残留的导电性。

英文摘要:

We report on the etching of graphene devices with a helium ion beam, including in situ electrical measurement during lithography. The etching process can be used to nanostructure and electrically isolate different regions in a graphene device, as demonstrated by etching a channel in a suspended graphene device with etched gaps down to about 10 nm. Graphene devices on silicon dioxide (SiO2) substrates etch with lower He ion doses and are found to have a residual conductivity after etching, which we attribute to contamination by hydrocarbons.

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