Ag/Si多层膜在热处理过程中的退化
Degradation of Ag/Si multilayers during heat treatments
摘要：
用X射线衍射和透射电镜研究了纳米银和非晶硅多层膜（Ag/a-Si）退火过程中的微结构变化。直流磁控溅射的Ag/a-Si多层膜在523 K退火10 h后仍保持稳定，只有在600 K以上才发生微结构变化。Ag/a-Si多层膜的劣化主要表现为Ag晶粒尺寸增大，在Ag晶界处形成沟槽和针孔，以及Si原子沿Ag/a-Si界面扩散。这导致a-Si层变薄，并且在较长的退火时间之后形成Ag颗粒。
英文摘要：
Microstructure changes during annealing of nano-crystalline silver and amorphous silicon multilayers (Ag/a-Si) have been studied by X-ray diffraction and transmission electron microscopy. The dc-magnetron sputtered Ag/a-Si multilayers remained stable even after annealing at 523K for 10h, and microstructural changes occurred only above 600K. The degradation of Ag/a-Si multilayers can be described by the increase of size of Ag grains, formation of grooves and pinholes at Ag grain boundaries and by the diffusion of silicon atoms through the silver grain boundaries and along the Ag/a-Si interfaces. This results in thinning of a-Si layers, and in formation of Ag granulates after longer annealing times.
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