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arXiv 2503.03608quant-phcond-mat.supr-con

带有片上射频组件的紧凑型超导动态电感行波参量放大器

Compact Superconducting Kinetic Inductance Traveling Wave Parametric Amplifiers with On-chip rf Components

Logan Howe, Andrea Giachero, Michael Vissers, Jordan Wheeler, Jason Austermann, Johannes Hubmayr, Joel Ullom

AI总结:

该研究设计了片上微加工偏置三通和定向耦合器,实现了三波混频动态电感行波参量放大器的全集成,大幅减小占用空间并消除外部有损组件,获得17.5 dB增益和3.4量子系统噪声。

摘要:

使用超导技术的量子计算系统和基础物理实验经常需要工作在附加噪声量子极限附近的信号放大链。Josephson参量放大器(JPAs)和行波参量放大器(TWPAs)都被用作第一级放大器,以使读出链在距离量子极限几个量子或更少的范围内运行。这些器件目前也正在进入商业产业。然而,几乎所有的演示和现有产品都需要笨重的外部微波组件来实现互连和施加必要的偏置。这些组件——电缆互连、偏置三通、定向耦合器和双工器——增加了放大器的整体占用空间和安装复杂性,并减少了本已有限的可用低温空间。此外,这些组件引入了损耗和反射,影响了测量效率和读出系统的噪声性能;因此使得在量子极限附近运行变得更加困难。在此,我们展示了用于操作三波混频动态电感TWPAs(KITs)的微加工偏置三通和定向耦合器的设计与验证。我们报告了与微加工射频组件集成的KITs的性能。使用这些器件,我们展示了放大器安装占用空间减少了近五倍,并消除了以前操作KIT所需的所有外部有损微波组件。我们的器件显示出2.8 GHz的3 dB带宽,中值真实增益为17.5 dB,中值系统噪声为3.4量子。这些努力代表了TWPA操作所需的所有射频组件在片上的首次完全集成。我们的结果标志着参量放大器装置的小型化和简化取得了重大进展,并将有助于其更广泛的应用。

英文摘要:

Quantum computing systems and fundamental physics experiments using superconducting technologies frequently require signal amplification chains operating near the quantum limit of added noise. Both Josephson parametric amplifiers (JPAs) and traveling wave parametric amplifiers (TWPAs) have been used as first-stage amplifiers to enable readout chains operating within a few quanta or less of the quantum limit. These devices are also presently entering the commercial industry. However, nearly all demonstrations and existing products require bulky external microwave components for interconnection and application of requisite biases. These components -- cabling interconnects, bias tees, directional couplers, and diplexers -- increase the overall amplifier footprint, installation complexity, and reduce already limited available cryogenic volumes. Additionally, these components introduce loss and reflections which impact the measurement efficiency and readout system noise performance; thus making it more difficult to operate near the quantum limit. Here we present the design and validation of microfabricated bias tees and directional couplers for operating three-wave mixing kinetic inductance TWPAs (KITs). We report the performance of KITs integrated with the microfabricated rf components. Using these devices we demonstrate reduction in the amplifier installation footprint by a factor of nearly five and elimination of all external, lossy microwave components previously required to operate a KIT. Our device displays a 2.8 GHz 3 dB bandwidth with a median true gain of 17.5 dB and median system noise of 3.4 quanta. These efforts represent the first full integration of all rf components mandatory for TWPA operation on-chip. Our results mark significant progress towards the miniaturization and simplification of parametric amplifier setups and will aid in their more widespread applicability.

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