已有研究表明，将编程电压降低至与片上逻辑兼容的 < 1 V 值，可能会极大促进铁电（FE）材料的广泛应用。面临的障碍包括将 FE 缩减至更低厚度的问题，以及在高介电常数 FE 与衬底之间存在界面层（IL）——导致 IL 上产生电压浪费。在此，我们展示了如何通过 IL 工程实现更低的工作电压和更高的隧道电阻（TER）。我们使用压电响应力显微镜并制备了铁电隧道结（FTJs），证明沉积在单层石墨烯上的超薄 FE 薄膜能够在 ~ 0.8 V 下实现极化切换，并具有显著的 TER。
英文摘要：
It has been indicated that the path forward for the widespread usage of ferroelectric (FE) materials may be considerably facilitated through the reduction of programming voltages to on-chip logic compatible values of < 1 V. Obstacles involve issues related to the scaling of the FEs to lower thickness as well as the presence of an interfacial layer (IL) between the high permittivity FE and the substrate -- resulting in wasted voltage across the IL. Here, we show how lower operating voltages along with a higher tunneling electroresistance (TER) could be achieved through IL engineering. We use piezoresponse force microscopy and fabricated ferroelectric tunnel junctions (FTJs) to show that ultra-thin FE films deposited on single layer graphene can exhibit polarization switching at ~ 0.8 V with significant TER.
A ferroelectric tunnel barrier in between two ferromagnetic electrodes (multiferroic tunnel junction, MFTJ), is one of the most promising concepts for future microelectronic devices. In parallel, Hafnia based ferroelectrics are showing great potential for device miniaturization down to the nanoscale. Here we utilize ferroelectric Hf0.5Zr0.5O2 (HZO) with thickness of only 2 nm, epitaxially grown on La0.7Sr0.3MnO3 (LSMO) ferromagnetic electrodes, as a large band-gap insulating barrier integrated in MFTJs with cobalt top electrodes. As previously reported for other MFTJs with similar electrodes, …
In ferroelectric materials, spontaneous symmetry breaking leads to a switchable electric polarization, which offers significant promise for nonvolatile memories. In particular, ferroelectric tunnel junctions (FTJs) have emerged as a new resistive switching memory which exploit polarization-dependent tunnel current across a thin ferroelectric barrier. Here we demonstrate FTJs with CMOS-compatible Zr-doped HfO$_2$ (Zr:HfO$_2$) ferroelectric barriers of just 1 nm thickness, grown by atomic layer deposition on silicon. These 1 nm Zr:HfO$_2$ tunnel junctions exhibit large polarization-driven electr…
The ferroelectric material is an important platform to realize non-volatile memories. So far, existing ferroelectric memory devices utilize out-of-plane polarization in ferroelectric thin films. In this paper, we propose a new type of random-access memory (RAM) based on ferroelectric thin films with the in-plane polarization called "in-plane ferroelectric tunnel junction". Apart from non-volatility, lower power usage and faster writing operation compared with traditional dynamic RAMs, our proposal has the advantage of faster reading operation and non-destructive reading process, thus overcomes…
We report a complementary metal oxide semiconductor (CMOS) technology compatible ferroelectric tunnel junction memristor grown directly on top of a Silicon substrate using a scandium doped aluminum nitride as the ferroelectric layer.
Designing high endurance Hf0.5Zr0.5O2 capacitors through engineered recovery from fatigue for non-volatile ferroelectric memory and neuromorphic hardware
My research is dedicated to the electronic properties of functional oxides. My activity specifically focuses on ferroelectric tunnel junctions in which an ultrathin layer of ferroelectric material is intercalated between two metallic electrodes. In these devices, polarization reversal induces large modifications of the tunnel resistance, leading to a non-destructive readout of the information. After a demonstration of the concept with scanning probe microscopy techniques, I have been exploring the properties of ferroelectric tunnel junctions with various ferroelectric materials (BaTiO3, BiFeO3…
Ferroelectric tunnel junction devices based on ferroelectric thin films of solid solutions of hafnium dioxide can enable CMOS integration of ultra-low power ferroelectric devices with potential for memory and emerging computing schemes such as in-memory computing and neuromorphic applications. In this work, we present ferroelectric tunnel junctions based on Hf$_{0.5}$Zr$_{0.5}$O$_{2}$ with materials and processes compatible with CMOS back-end-of-line integration. We show a device architecture based on W-Hf$_{0.5}$Zr$_{0.5}$O$_{2}$-Al$_{2}$O$_{3}$-TiN stacks featuring low temperature annealing …
We report on the fabrication of organic multiferroic tunnel junction (OMFTJ) based on an organic barrier of Poly(vinylidene fluoride) (PVDF):Fe3O4 nanocomposite. By adding Fe3O4 nanoparticles into the PVDF barrier, we found that the ferroelectric properties of the OMFTJ are considerably improved compared to that with pure PVDF barrier. It can lead to a tunneling electroresistance (TER) of about 450% at 10K and 100% at room temperature (RT), which is much higher than that of the pure PVDF based device (70% at 10K and 7% at RT). OMFTJs based on the PVDF:Fe3O4 nanocomposite could open new functio…
Ferroelectric tunnel junctions (FTJ) based on hafnium zirconium oxide (Hf1-xZrxO2; HZO) are a promising candidate for future applications, such as low-power memories and neuromorphic computing. The tunneling electroresistance (TER) is tunable through the polarization state of the HZO film. To circumvent the challenge of fabricating thin ferroelectric HZO layers in the tunneling range of 1-3 nm range, ferroelectric/dielectric double layer sandwiched between two symmetric metal electrodes are used. Due to the decoupling of the ferroelectric polarization storage layer and a dielectric tunneling l…
In the quest for reliable and power-efficient memristive devices, ferroelectric tunnel junctions are being investigated as potential candidates. CMOS-compatible ferroelectric hafnium oxides are at the forefront. However, in epitaxial tunnel devices with thicknesses around ${\approx}$ 4 - 6 nm, the relatively high tunnel energy barrier produces a large resistance that challenges their implementation. Here, we show that ferroelectric and electroresistive switching can be observed in ultrathin 2 nm epitaxial Hf$_{0.5}$Zr$_{0.5}$O$_2$ (HZO) tunnel junctions in large area capacitors (${\approx} 300…
The Discovery of giant tunnel electroresistance (TER) in Ferroelectric Tunnel Junction (FTJ) paves a futuristic possibility of utilizing the FTJ as a bistable resistive device with an enormously high ON/OFF ratio. In the last 20 years, numerous studies have reported that the formation of multidomain in ferroelectric material is an inevitable process to minimize the total system energy. Recent studies based on phase-field simulations have demonstrated that domain nucleation/motion substantially alters the electrostatics of a ferroelectric material. However, the impact of domain dynamics on quan…
We report nanoscale bandgap engineering via a local strain across the inhomogeneous ferroelectric interface, which is controlled by the visible-light-excited probe voltage. Switchable photovolatic effects and the spectral response of the photocurrent were explore to illustrate the reversible bandgap variation (~0.3eV). This local-strain-engineered bandgap has been further revealed by in situ probe-voltage-assisted valence electron energy-loss spectroscopy (EELS). Phase-field simulations and first-principle calculations were also employed for illustration of the large local strain and the bandg…
Here, we propose a Charge Plasma (CP)-based Germanium Double Gate Tunnel Field-Effect Transistor (Ge-DGTFET) device structure, where a CP is induced in the heavily doped source region using the work function engineering of source electrode. The CP enables creation of electrical metallurgical junction and converts n-p-n to p-n-p-n structure of TFET and enhances the drain current, reliability, eliminate additional pocket ion-implantation. The proposed CP-Ge-DGTFET device structure revealed excellent electrical DC performance as compared to the conventional Ge-DGTFET device structure such as high…
Perpendicular magnetic tunnel junctions based on MgO/CoFeB structures are of particular interest for magnetic random-access memories because of their excellent thermal stability, scaling potential, and power dissipation. However, the major challenge of current-induced switching in the nanopillars with both a large tunnel magnetoresistance ratio and a low junction resistance is still to be met. Here, we report spin transfer torque switching in nano-scale perpendicular magnetic tunnel junctions with a magnetoresistance ratio up to 249% and a resistance area product as low as 7.0 Ω.μm2, which con…
Towards Improved Polarization Uniformity in Ferroelectric Hf$_{0.5}$Zr$_{0.5}$O$_2$ Devices within Back End of Line Thermal Budget for Memory and Neuromorphic Applications
The current work reports an efficient deep neural network (DNN) accelerator where synaptic weight elements are controlled by ferroelectric domain dynamics. An integrated device-to-algorithm framework for benchmarking novel synaptic devices is used. In P(VDF-TrFE) based ferroelectric tunnel junctions, analog conductance states are measured using a custom pulsing protocol and associated custom circuits and array architectures for DNN training is simulated. Our results show precise control of polarization switching dynamics in multi-domain, polycrystalline ferroelectric thin films can produce con…
Breakdown and polarization contrasts in ferroelectric devices observed by operando laser-based photoemission electron microscopy with the AC/DC electrical characterization system
The multiple ferroelectric polarization tuned by external electric field could be used to simulate the biological synaptic weight. Ferroelectric synaptic devices have two advantages compared with other reported ones: One is the intrinsic switching of ferroelectric domains without invoking of defect migration as in resistive oxides contributes reliable performance in these ferroelectric synapses. Another tremendous advantage is the extremely low energy consumption because the ferroelectric polarization is manipulated by electric field which eliminate the Joule heating by current as in magnetic …
