3D-Carbon：一款面向3D与2.5D集成电路的分析型碳建模工具
3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits
AI总结：
针对3D/2.5D集成电路缺乏全生命周期碳排放建模工具的问题，提出开源分析工具3D-Carbon，综合集成技术的节省、开销及带宽约束，并经基线验证和自动驾驶案例展示其效用。
摘要：
环境可持续性对集成电路（IC）整个生命周期都至关重要，尤其是在制造和使用阶段。同时，采用3D/2.5D集成技术的IC已成为满足不断增长的算力需求的有前景方案。然而，目前明显缺乏面向3D/2.5D IC的碳建模工具。针对这一问题，我们提出3D-Carbon，这是一款分析型碳建模工具，旨在量化3D/2.5D IC在整个生命周期中的碳排放。3D-Carbon同时考虑先进集成技术可能带来的节省与开销，并纳入带宽等实际部署约束。我们通过与既有基线比较验证了3D-Carbon的准确性，并通过自动驾驶汽车案例研究展示其实用性。我们认为3D-Carbon为未来开发环境可持续的3D/2.5D IC的创新奠定了初步基础。开源代码可在https://github.com/UMN-ZhaoLab/3D-Carbon获取。
英文摘要：
Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
