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arXiv 2306.04491physics.opticsphysics.app-ph
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用于低温混合光子集成的高质量非晶碳化硅

High-quality amorphous Silicon Carbide for hybrid photonic integration at low temperature

Bruno Lopez-Rodriguez, Roald Van Der Kolk, Samarth Aggarwal, Naresh Sharma, Zizheng Li, Daniel Van Der Plaats, Thomas Scholte, Jin Chang, Silvania F. Pereira, S… 展开作者

Bruno Lopez-Rodriguez, Roald Van Der Kolk, Samarth Aggarwal, Naresh Sharma, Zizheng Li, Daniel Van Der Plaats, Thomas Scholte, Jin Chang, Silvania F. Pereira, Simon Groeblacher, Harish Bhaskaran, Iman Esmaeil Zadeh Zadeh

AI总结:

本文提出在150°C低温沉积高质量a-SiC薄膜,通过波导和环形谐振器验证其低损耗性能,并展示其与SiN、LiNbO3平台异构混合集成的潜力。

摘要:

近年来,集成光子平台大量涌现,每一种都展现出其独特的优势与不足。然而,鉴于不同平台之间的工艺不兼容性,如何在一个混合集成平台中结合不同光学材料的优势,仍是集成光子学领域的一项艰巨挑战。碳化硅因其高折射率、强二阶和三阶非线性以及在可见光和近红外波段的宽透明窗口而成为备受关注的材料。但是,集成SiC一直十分困难,现有方法依赖转移键合技术,这类技术耗时、昂贵,且在层厚控制方面缺乏精度。在此,我们展示了在150°C下沉积的高折射率非晶碳化硅(a-SiC)薄膜,并通过制备标准光子波导和环形谐振器验证了该平台的高性能。单模环形谐振器的固有品质因数处于Q_int = (4.7–5.7)×10^5范围内,对应0.78–1.06 dB/cm的光学损耗。随后,我们展示了该平台未来与超低损耗薄SiN和LiNbO3平台进行异构集成的潜力。

英文摘要:

Integrated photonic platforms have proliferated in recent years, each demonstrating its own unique strengths and shortcomings. However, given the processing incompatibilities of different platforms, a formidable challenge in the field of integrated photonics still remains for combining the strength of different optical materials in one hybrid integrated platform. Silicon carbide is a material of great interest because of its high refractive index, strong second and third-order non-linearities and broad transparecy window in the visible and near infrared. However, integrating SiC has been difficult, and current approaches rely on transfer bonding techniques, that are time consuming, expensive and lacking precision in layer thickness. Here, we demonstrate high index Amorphous Silicon Carbide (a-SiC) films deposited at 150$^{\circ}$C and verify the high performance of the platform by fabricating standard photonic waveguides and ring resonators. The intrinsic quality factors of single-mode ring resonators were in the range of $Q_{int} = (4.7-5.7)\times10^5$ corresponding to optical losses between 0.78-1.06 dB/cm. We then demonstrate the potential of this platform for future heterogeneous integration with ultralow loss thin SiN and LiNbO$_3$ platforms.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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