通过灰度硬掩模光刻在碳化硅中可规模化制造半球形固体浸没透镜
Scalable fabrication of hemispherical solid immersion lenses in silicon carbide through grayscale hard-mask lithography
AI总结：
该研究提出一种结合灰度光刻与硬掩模的新工艺，在碳化硅上制造半径5微米的近半球形固体浸没透镜，具有高可扩展性、CMOS兼容性，并可通过干法蚀刻调节纵横比，为聚焦离子束铣削提供低成本、高产量替代方案。
摘要：
灰度光刻允许在完全兼容标准光刻的工艺中创建具有空间控制高度的微米级特征。在此，通过一种结合灰度光刻和硬掩模技术的新型制造方案，在碳化硅中展示了固体浸没透镜，使得能够将半径约为5微米的近半球形透镜蚀刻到衬底中。该技术高度可扩展且与CMOS技术兼容，器件纵横比可在抗蚀剂图案化后通过控制后续干法蚀刻的化学性质进行调节。这些结果为创建高纵横比、圆角微结构提供了一种低成本、高产量且与工业相关的聚焦离子束铣削替代方案。
英文摘要：
Grayscale lithography allows the creation of micrometer-scale features with spatially-controlled height in a process that is fully compatible with standard lithography. Here, solid immersion lenses are demonstrated in silicon carbide using a novel fabrication protocol combining grayscale lithography and hard-mask techniques to allow nearly hemispherical lenses of 5 $μ$m radius to be etched into the substrate. The technique is highly scalable and compatible with CMOS technology, and device aspect ratios can be tuned after resist patterning by controlling the chemistry of the subsequent dry etch. These results provide a low-cost, high-throughput and industrially-relevant alternative to focused ion beam milling for the creation of high-aspect-ratio, rounded microstructures.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
