In a hard switched MOSFET based converter, turn-on energy losses is predominant in the total switching loss. At higher junction temperature the turn-on energy loss further increases due to the reverse recovery effect of the complementary MOSFETs body diode in a half-bridge configuration. Estimation of the switching loss under different operating conditions at an early design stage is essential for optimising the thermal design. Analytical switching loss models available in literature are generally used for estimating the switching losses, due to its accuracy and simplicity. In this paper, the inaccuracy in the reported loss models due to non inclusion of temperature dependent reverse recovery characteristics of body diode, is investigated. A structured method to determine the temperature-dependent switching loss of a SiC MOSFET in a half-bridge is presented. A simple methodology has been proposed to analyze the carrier lifetime's temperature dependencies of a SiC MOSFETs body diode. Device parameters from a 1.2kV/36A SiC MOSFETs datasheet are used for developing the loss model and experimental validation of the model.
This paper aims to give a short overview on some relevant processing issues existing in SiC and GaN power devices technology. The main focus is put on the importance of the channel mobility in transistors, which is one of the keys to reduce RON and power dissipation. Specifically, in the case of the 4H-SiC planar MOSFETs the most common solutions and recent trends to improve the channel mobility are presented. In the case of GaN, the viable routes to achieve normally-off HEMTs operation are briefly introduced, giving emphasis to the case of the recessed hybrid MISHEMT.
In this work, the origin of the low free electron mobility in SiC MOSFETs is investigated using the scattering theory of two-dimensional electron gases. We first establish that neither phonon scattering nor Coulomb scattering can be the cause of the low observed mobility in SiC MOSFETs; we establish this fact by comparing the theoretically calculated mobility considering these effects with experimental observations. By considering the threshold voltages and the effective field dependence of the mobility in SiC MOSFETs, it is concluded that the scattering centers of the dominant mechanism are e…
Inter-terminal capacitances (ITCs) have major influence on the dynamic performance of power SiC MOSFETs. Knowledge of the exact values for the ITCs is required in order to perform accurate and predictive compact model simulations of their dynamic performance. Since commercial SiC MOSFETs are capable of operating in a wide range of temperatures, it is important to know the values of ITCs in the whole temperature range of operation. Direct measurements of the ITCs with standard equipment is possible only at low current levels (i.e. in the off-state (Vgs < Vth) for Vds > 0 V), however their value…
Thermal transient measurement based on source-drain voltage is a standard method to characterize thermal properties of silicon semiconductors but is doubtful to be directly applied to silicon carbide (SiC) devices. To evaluate its feasibility and limitations, this paper conducts a comprehensive investigation into its accuracy, resolution, and stability towards yielding the structure information of SiC MOSFET using the source-drain voltage as the temperature sensitive electrical parameter. The whole characterization process involves two main procedures and associated key testing parameters, suc…
A non-relaxing method based on cyclic gate bias stress is used to probe the interface or near-interface traps in the SiO$_2$/4H-SiC system over the whole 4H-SiC band gap. The temperature dependent instability of the threshold voltage in lateral MOSFETs is investigated and two separated trapping mechanisms were found. One mechanism is nearly temperature independent and it is correlated to the presence of near interface oxide traps that are trapped via tunneling from the semiconductor. The second mechanism, having an activation energy of 0.1 eV, has been correlated to the presence of intrinsic d…
The origin of dielectric breakdown was studied on 4H-SiC MOSFETs that failed after three months of high temperature reverse bias (HTRB) stress. A local inspection of the failed devices demonstrated the presence of a threading dislocation (TD) at the breakdown location. The nanoscale origin of the dielectric breakdown was highlighted with advanced high-spatial-resolution scanning probe microscopy (SPM) techniques. In particular, SPM revealed the conductive nature of the TD and a local increase of the minority carrier concentration close to the defect. Numerical simulations estimated a hole conc…
Time-Gated Optical Spectroscopy of Field-Effect Stimulated Recombination via Interfacial Point Defects in Fully-Processed Silicon Carbide Power MOSFETs
Renewable energy source such as photovoltaic (PV) cell generates power from the sun light by converting solar power to electrical power with no moving parts and less maintenance. A single photovoltaic cell produces voltage of low level. In order to boost up the voltage, a DC-DC boost converter is used. In order to use this DC-DC converter for high voltage and high frequency applications, Silicon Carbide (SiC) device is most preferred because of larger current carrying capability, higher voltage blocking capability, high operating temperature and less static and dynamic losses than the traditio…
Ulta-wide bandgap semiconductors based on $β$-Ga$_2$O$_3$ offer the potential to achieve higher power switching performance, efficiency, and lower manufacturing cost than today's wide bandgap power semiconductors. However, the most critical challenge to the commercialization of Ga$_2$O$_3$ electronics is overheating, which impacts the device's performance and reliability. We fabricated a Ga$_2$O$_3$/4H-SiC composite wafer using a fusion-bonding method. A low temperature ($\le$ 600 $^{\circ}$C) epitaxy and device processing approach based on low-temperature (LT) metalorganic vapor phase epitaxy…
In this work, the origin of the dielectric breakdown of 4H-SiC power MOSFETs was studied at the nanoscale, analyzing devices that failed after extremely long (three months) of high temperature reverse bias (HTRB) stress. A one-to-one correspondence between the location of the breakdown event and a threading dislocation propagating through the epitaxial layer was found. Scanning probe microscopy (SPM) revealed the conductive nature of the threading dislocation and a local modification of the minority carriers concentration. Basing on these results, the role of the threading dislocation on the f…
Impact of the NO annealing duration on the SiO2/4H-SiC interface properties in lateral MOSFETs: the energetic profile of the near-interface-oxide traps
This paper reports on the physical and temperature-dependent electrical characterizations of the oxide/semiconductor interface in MOS capacitors with a SiO2 layer deposited on 4H-SiC using dichlorosilane and nitrogen-based vapor precursors. The capacitors, subjected to a standard post deposition annealing process in N2O, exhibited an interface state density Dit = 9.0 x 1011cm-2eV-1 below the conduction band edge. At room temperature, a barrier height (conduction band offset) of 2.8 eV was observed, along with the presence of negative charges in the insulator. The SiO2 insulating properties wer…
We report findings on the Ion Beam Induced Charge (IBIC) characterization of a 4H-SiC Schottky barrier diode (SBD), in terms of the modification of the Charge Collection Efficiency (CCE) distribution induced by 20 MeV C ions irradiations with fluences ranging from 20 to 200 ions/um2. The lateral IBIC microscopy with 4 MeV protons over the SBD cross section, carried out on the pristine diode evidenced the widening of the depletion layer extension as function of the applied bias and allowed the measurement of the minority carrier diffusion lengths. After the irradiation with C ions, lateral IBIC…
In this paper, the electrical behavior of tungsten carbide (WC) Schottky barrier on 4H-SiC was investigated. First, a statistical current-voltage (I-V) analysis in forward bias, performed on a set of equivalent diodes, showed a symmetric Gaussian-like distribution of the barrier heights after annealing at 700°C, where a low Schottky barrier height ($Φ$B=1.05 eV) and an ideality factor n=1.06 were measured. The low value of the barrier height makes such a WC contact an interesting candidate to reduce the conduction losses in 4H-SiC Schottky diodes. A deeper characterization has been carried out…
Electrically driven light sources are essential in a wide range of applications, from indication and display technologies to high-speed data communication and quantum information processing. Wide-bandgap semiconductors promise to advance solid-state lighting by delivering novel light sources. However, electrical pumping of these devices is still a challenging problem. Many wide-bandgap semiconductor materials, such as SiC, GaN, AlN, ZnS, and Ga2O3, can be easily doped n-type, but their efficient p-type doping is extremely difficult. The lack of holes due to the high activation energy of accept…
In this paper, we investigate the electrical evolution of tungsten (W) and tungsten carbide (WC) Schottky contacts on 4H-SiC subjected to thermal treatments at different annealing temperatures from 475 to 700 ° C. For each annealing temperature, the uniformity of the Schottky barrier height (${ϕ_B}$) and ideality factor (n) was monitored by current-voltage (I-V) measurements in forward bias, performed over sets of equivalent diodes. Good values of n (below 1.05) were found for both contacts up to thermal annealing at 700 ° C. On the other hand, the barrier of the two contacts behaves different…
This work reports on the effect of high temperature annealing on the electrical properties of p-type implanted 4H-SiC. Ion implantations of Aluminium (Al) at different energies (30 - 200 keV) were carried out to achieve 300 nm thick acceptor box profiles with a concentration of about 1020 at/cm3. The implanted samples were annealed at high temperatures (1675-1825 °C). Morphological analyses of the annealed samples revealed only a slight increase of the surface roughness RMS up to 1775°C, while this increase becomes more significant at 1825°C (RMS=1.2nm). Room temperature Hall measurements resu…
The electrical behavior of Ni Schottky barrier formed onto heavily doped (ND>1019 cm-3) n-type phosphorous implanted silicon carbide (4H-SiC) was investigated, with a focus on the current transport mechanisms in both forward and reverse bias. The forward current-voltage characterization of Schottky diodes showed that the predominant current transport is a thermionic-field emission mechanism. On the other hand, the reverse bias characteristics could not be described by a unique mechanism. In fact, under moderate reverse bias, implantation-induced damage is responsible for the temperature increa…
Würzburg-Dresden Cluster of Excellence ctd.qmat（维尔茨堡-德累斯顿卓越集群 ctd.qmat）；NASA Jet Propulsion Laboratory, California Institute of Technology（美国宇航局喷气推进实验室，加州理工学院）
