Construction and commissioning of CMS CE prototype silicon modules
B. Acar, G. Adamov, C. Adloff, S. Afanasiev, N. Akchurin, B. Akgün, M. Alhusseini, J. Alison, G. Altopp, M. Alyari, S. An, S. Anagul, I. Andreev, M. Andrews, P.… 展开作者
B. Acar, G. Adamov, C. Adloff, S. Afanasiev, N. Akchurin, B. Akgün, M. Alhusseini, J. Alison, G. Altopp, M. Alyari, S. An, S. Anagul, I. Andreev, M. Andrews, P. Aspell, I. A. Atakisi, O. Bach, A. Baden, G. Bakas, A. Bakshi, P. Bargassa, D. Barney, E. Becheva, P. Behera, A. Belloni, T. Bergauer, M. Besancon, S. Bhattacharya, S. Bhattacharya, D. Bhowmik, P. Bloch, A. Bodek, M. Bonanomi, A. Bonnemaison, S. Bonomally, J. Borg, F. Bouyjou, D. Braga, J. Brashear, E. Brondolin, P. Bryant, J. Bueghly, B. Bilki, B. Burkle, A. Butler-Nalin, S. Callier, D. Calvet, X. Cao, B. Caraway, S. Caregari, L. Ceard, Y. C. Cekmecelioglu, G. Cerminara, N. Charitonidis, R. Chatterjee, Y. M. Chen, Z. Chen, K. y. Cheng, S. Chernichenko, H. Cheung, C. H. Chien, S. Choudhury, D. Čoko, G. Collura, F. Couderc, I. Dumanoglu, D. Dannheim, P. Dauncey, A. David, G. Davies, E. Day, P. DeBarbaro, F. De Guio, C. de La Taille, M. De Silva, P. Debbins, E. Delagnes, J. M. Deltoro, G. Derylo, P. G. Dias de Almeida, D. Diaz, P. Dinaucourt, J. Dittmann, M. Dragicevic, S. Dugad, V. Dutta, S. Dutta, J. Eckdahl, T. K. Edberg, M. El Berni, S. C. Eno, Yu. Ershov, P. Everaerts, S. Extier, F. Fahim, C. Fallon, B. A. Fontana Santos Alves, E. Frahm, G. Franzoni, J. Freeman, T. French, E. Gurpinar Guler, Y. Guler, M. Gagnan, P. Gandhi, S. Ganjour, A. Garcia-Bellido, Z. Gecse, Y. Geerebaert, H. Gerwig, O. Gevin, W. Gilbert, A. Gilbert, K. Gill, C. Gingu, S. Gninenko, A. Golunov, I. Golutvin, T. Gonzalez, N. Gorbounov, L. Gouskos, Y. Gu, F. Guilloux, E. Gülmez, M. Hammer, A. Harilal, K. Hatakeyama, A. Heering, V. Hegde, U. Heintz, V. Hinger, N. Hinton, J. Hirschauer, J. Hoff, W. S. Hou, C. Isik, J. Incandela, S. Jain, H. R. Jheng, U. Joshi, O. Kara, V. Kachanov, A. Kalinin, R. Kameshwar, A. Kaminskiy, A. Karneyeu, O. Kaya, M. Kaya, A. Khukhunaishvili, S. Kim, K. Koetz, T. Kolberg, A. Kristić, M. Krohn, K. Krüger, N. Kulagin, S. Kulis, S. Kunori, C. M. Kuo, V. Kuryatkov, S. Kyre, O. K. Köseyan, Y. Lai, K. Lamichhane, G. Landsberg, J. Langford, M. Y. Lee, A. Levin, A. Li, B. Li, J. -H. Li, H. Liao, D. Lincoln, L. Linssen, R. Lipton, Y. Liu, A. Lobanov, R. S. Lu, I. Lysova, A. M. Magnan, F. Magniette, A. A. Maier, A. Malakhov, I. Mandjavize, M. Mannelli, J. Mans, A. Marchioro, A. Martelli, P. Masterson, B. Meng, T. Mengke, A. Mestvirishvili, I. Mirza, S. Moccia, I. Morrissey, T. Mudholkar, J. Musić, I. Musienko, S. Nabili, A. Nagar, A. Nikitenko, D. Noonan, M. Noy, K. Nurdan, C. Ochando, B. Odegard, N. Odell, Y. Onel, W. Ortez, J. Ozegović, L. Pacheco Rodriguez, E. Paganis, D. Pagenkopf, V. Palladino, S. Pandey, F. Pantaleo, C. Papageorgakis, I. Papakrivopoulos, J. Parshook, N. Pastika, M. Paulini, P. Paulitsch, T. Peltola, R. Pereira Gomes, H. Perkins, P. Petiot, F. Pitters, F. Pitters, H. Prosper, M. Prvan, I. Puljak, T. Quast, R. Quinn, M. Quinnan, K. Rapacz, L. Raux, G. Reichenbach, M. Reinecke, M. Revering, A. Rodriguez, T. Romanteau, A. Rose, M. Rovere, A. Roy, P. Rubinov, R. Rusack, A. E. Simsek, U. Sozbilir, O. M. Sahin, A. Sanchez, R. Saradhy, T. Sarkar, M. A. Sarkisla, J. B. Sauvan, I. Schmidt, M. Schmitt, E. Scott, C. Seez, F. Sefkow, S. Sharma, I. Shein, A. Shenai, R. Shukla, E. Sicking, P. Sieberer, Y. Sirois, V. Smirnov, E. Spencer, A. Steen, J. Strait, T. Strebler, N. Strobbe, J. W. Su, E. Sukhov, L. Sun, M. Sun, C. Syal, B. Tali, U. G. Tok, A. Kayis Topaksu, C. L. Tan, I. Tastan, T. Tatli, R. Thaus, S. Tekten, D. Thienpont, T. Pierre-Emile, E. Tiras, M. Titov, D. Tlisov, J. Troska, Z. Tsamalaidze, G. Tsipolitis, A. Tsirou, N. Tyurin, S. Undleeb, D. Urbanski, V. Ustinov, A. Uzunian, M. van de Klundert, J. Varela, M. Velasco, M. Vicente Barreto Pinto, P. M. da Silva, T. Virdee, R. Vizinho de Oliveira, J. Voelker, E. Voirin, Z. Wang, X. Wang, F. Wang, M. Wayne, S. N. Webb, M. Weinberg, A. Whitbeck, D. White, R. Wickwire, J. S. Wilson, H. Y. Wu, L. Wu, C. H Yeh, R. Yohay, G. B. Yu, S. S. Yu, D. Yu, F. Yumiceva, A. Zacharopoulou, N. Zamiatin, A. Zarubin, S. Zenz, H. Zhang, J. Zhang
As part of its HL-LHC upgrade program, the CMS Collaboration is developing a High Granularity Calorimeter (CE) to replace the existing endcap calorimeters. The CE is a sampling calorimeter with unprecedented transverse and longitudinal readout for both electromagnetic (CE-E) and hadronic (CE-H) compartments. The calorimeter will be built with $\sim$30,000 hexagonal silicon modules. Prototype modules have been constructed with 6-inch hexagonal silicon sensors with cell areas of 1.1~$cm^2$, and the SKIROC2-CMS readout ASIC. Beam tests of different sampling configurations were conducted with the prototype modules at DESY and CERN in 2017 and 2018. This paper describes the construction and commissioning of the CE calorimeter prototype, the silicon modules used in the construction, their basic performance, and the methods used for their calibration.
Commissioning and Operation of the New CMS Phase-1 Pixel Detector
CMS像素探测器的第一阶段升级由四个桶层（BPix）和每个端盖（FPix）中的三个前向磁盘组成。它在1，856个模块中包含总共1.24亿像素通道，其设计可承受高达$2 \times 10^{34}\,$ cm $^{-2}$ s $^{-1}$的瞬时亮度。探测器的不同部分在去年组装完成，后来被带到CERN安装在CMS跟踪器内。在组装过程中的各个阶段，已经进行了测试，以确保读出和电力电子设备以及冷却系统符合设计规范。在对各个组件进行测试之后，在CMS内部安装之前进行了系统测试。除了审查这些测试，我们还介绍了使用中央CMS DAQ系统现场检测器的最终调试结果。最后，我们审查的结果，从最初的操作的探测器首先与宇宙射线，然后与pp碰撞。
Study of the readout chip and silicon sensor degradation for the CMS pixel upgrade
混合硅像素探测器目前用于紧凑型μ子螺线管（CMS）实验的最内部跟踪系统。已经证明了大型强子对撞机（LHC）运行几年所能承受的辐射通量，尽管预计硅探测器靠近相互作用点的部分会出现一些退化。在大型强子对撞机升级阶段，硅像素探测器预计的剂量水平将高得多。为了面对这个方面，已经在硅传感器和读出芯片上执行了具有高于$\mathcal{O}(10^{15})$ n $_{\textrm{eq}}$ /cm $^2$的注量的专用辐照测试。在操作中的传感器和读出芯片的能量密度的函数的变化。的电荷收集效率进行了研究：部分恢复的检测器的效率，可以通过操作的检测器在一个受控的环境中，并在较高的偏置电压。
Experimental Study of Different Silicon Sensor Options for the Upgrade of the CMS Outer Tracker
在计划于2027年左右开始的大型强子对撞机（HL-LHC）的高光度阶段，加速器预计将提供高达$7.5\times10^{34}$ cm $^{-2}$ s $^{-1}$的瞬时峰值光度。预计在未来十年内，$3000$或甚至$4000$ ~fb $^{-1}$的总积分亮度将被交付给通用探测器ATLAS和CMS，从而显著增加LHC实验的发现潜力。CMS探测器将为HL-LHC进行重大升级，全新的跟踪探测器由外部跟踪器和内部跟踪器组成。然而，新的跟踪系统将暴露在比当前跟踪器高得多的辐射下，需要新的抗辐射传感器。CMS从2009年开始发起了一项广泛的辐照和测量活动，系统地比较不同硅材料的特性和外跟踪器传感器的设计选择。在18种不同的晶圆材料、厚度和生产技术组合上设计并实现了几种测试结构和传感器。在用中子和不同能量的质子辐照之前和之后，对装置进行电气表征，其中通量对应于在$3000$ ~fb $^{-1}$之后CMS外跟踪器的不同半径处预期的通量。所执行的测试包括使用$β$源、激光和光束扫描的研究。本文比较了HL-LHC硅传感器的不同选择的性能，重点是硅块材料和厚度。
Measurements with silicon photomultipliers of dose-rate effects in the radiation damage of plastic scintillator tiles in the CMS hadron endcap calorimeter
The CMS High-Granularity Calorimeter for Operation at the High-Luminosity LHC
高亮度LHC（HL-LHC）将集成比LHC高10倍的亮度，对探测器的辐射耐受性和事件堆积提出了重大挑战，特别是对于前向量热法，并标志着未来对撞机的问题。作为其HL-LHC升级计划的一部分，CMS合作正在设计一种高粒度量热计，以取代现有的端盖量热计。它具有前所未有的横向和纵向分割电磁（ECAL）和强子（HCAL）隔间。这将促进粒子流量热法，其中可以测量簇射的精细结构并用于增强堆积排斥和粒子识别，同时仍然实现良好的能量分辨率。ECAL和大部分HCAL将基于0.5至1 cm $^2$单元尺寸的六边形硅传感器，其余HCAL基于具有SiPM读出的高度分段的放大器。硅传感器固有的高精度计时能力将为事件重建增加额外的维度，特别是在堆积拒绝方面。HGCAL项目的概述，包括动机，工程设计，读出和触发的概念，和预期的性能。
