3D片上网络的功耗、散热和可靠性预测报告
Report on power, thermal and reliability prediction for 3D Networks-on-Chip
摘要：
通过将三维集成电路与片上网络基础设施相结合以获得3D片上网络（3D-NoC），新的片上通信范例带来了低功耗、小尺寸和低延迟的几个优点。然而，散热是3D-IC最关键的挑战之一，其中热量无法轻易地通过几层硅传递。因此，高温区域也面临着可靠性威胁，因为平均故障时间（MTTF）随工作温度呈指数下降。显然，3D-NoCs必须解决这个基本问题才能得到广泛应用。因此，在这项工作中，我们研究的热分布和可靠性预测的3D-NoCs。我们首先提出了一种新的方法来帮助模拟温度（包括稳态和瞬态）使用交通值从现实和合成基准和功耗从标准的VLSI设计流程。然后，基于所提出的方法，我们进一步预测网络的不同部分之间的相对可靠性。实验结果表明，该方法具有非常快的执行时间相比，加速寿命测试。此外，我们比较了单片设计和TSV基TSV的热行为和可靠性。我们还探索了通过一种机制来实现热量的能力，以帮助降低工作温度。
英文摘要：
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower latency. However, thermal dissipation is one of the most critical challenges for 3D-ICs where the heat cannot easily transfer through several layers of silicon. Consequently, the high-temperature area also confronts the reliability threat as the Mean Time to Failure (MTTF) decreases exponentially with the operating temperature. Apparently, 3D-NoCs must tackle this fundamental problem in order to be widely used. Therefore, in this work, we investigate the thermal distribution and reliability prediction of 3D-NoCs. We first present a new method to help simulate the temperature (both steady and transient) using traffics value from realistic and synthetic benchmarks and the power consumption from standard VLSI design flow. Then, based on the proposed method, we further predict the relative reliability between different parts of the network. Experimental results show that the method has an extremely fast execution time in comparison to the acceleration lifetime test. Furthermore, we compare the thermal behavior and reliability between Monolithic design and TSV-based TSV. We also explorer the ability to implement the thermal via a mechanism to help reduce the operating temperature.
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