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arXiv 1908.09412cond-mat.mes-hallcond-mat.other
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拓扑绝缘体薄膜中的寄生导电通道

Parasitic conduction channels in topological insulator thin films

Sven Just, Felix Lüpke, Vasily Cherepanov, F. Stefan Tautz, Bert Voigtländer

AI总结:

针对拓扑绝缘体薄膜中寄生导电通道干扰拓扑保护表面态输运特性的问题,提出利用表面敏感测量参数计算近表面能带弯曲,进而估算薄膜内部载流子浓度与电导率,结合预沉积衬底测量可靠确定各通道贡献。

摘要:

拓扑绝缘体(TI)薄膜通常存在多个平行导电通道用于电流输运。除了受拓扑保护的表面态(TSS)外,还可能存在平行通道,即并非理想绝缘的TI薄膜内部、与衬底的界面层以及衬底本身。为了能够利用TSS优异的输运特性,必须将寄生平行通道对总电流输运的影响降至最低。由于TI薄膜内部(体相)的电导率难以通过测量获得,我们在此提出一种计算TI薄膜中可动载流子浓度的方法。为此,我们利用从表面敏感测量(即随栅极变化的四点电阻测量和角分辨光电子能谱(ARPES))中实验得到的参数,计算近表面的能带弯曲。虽然在大多数情况下,计算中的另一个参数,即TI薄膜内部的无意掺杂浓度是未知的,但结果表明,在薄膜极限下,能带弯曲在很大程度上与薄膜中的掺杂浓度无关。因此,对TI薄膜内部的总可动载流子浓度和电导率进行有充分依据的估算是可行的。由于界面和衬底的电导率可以在沉积TI薄膜之前通过四探针电导测量得到,因此所有寄生通道的总贡献,以及至关重要的TSS的贡献,都可以可靠地确定。

英文摘要:

Thin films of topological insulators (TI) usually exhibit multiple parallel conduction channels for the transport of electrical current. Beside the topologically protected surface states (TSS), parallel channels may exist, namely the interior of the not-ideally insulating TI film, the interface layer to the substrate, and the substrate itself. To be able to take advantage of the auspicious transport properties of the TSS, the influence of the parasitic parallel channels on the total current transport has to be minimized. Because the conductivity of the interior (bulk) of the thin TI film is difficult to access by measurements, we propose here an approach for calculating the mobile charge carrier concentration in the TI film. To this end, we calculate the near-surface band bending using parameters obtained experimentally from surface-sensitive measurements, namely (gate-dependent) four-point resistance measurements and angle-resolved photoelectron spectroscopy (ARPES). While in most cases another parameter in the calculations, i.e. the concentration of unintentional dopants inside the thin TI film, is unknown, it turns out that in the thin-film limit the band bending is largely independent of the dopant concentration in the film. Thus, a well-founded estimate of the total mobile charge carrier concentration and the conductivity of the interior of the thin TI film proves possible. Since the interface and substrate conductivities can be measured by a four-probe conductance measurement prior to the deposition of the TI film, the total contribution of all parasitic channels, and therefore also the contribution of the vitally important TSS, can be determined reliably.

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