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arXiv 1608.01029cond-mat.mtrl-sci
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高磷掺杂浓度硅锗互扩散研究

Study Of Si-Ge Interdiffusion With a High Phosphorus Doping Concentration

Feiyang Cai, Dalaver H. Anjum, Xixiang Zhang, Guangrui, Xia

摘要:

通过实验和模拟研究了高磷掺杂水平的硅锗互扩散。研究了Ge/Si_(1-x)Gex/Ge多层膜结构,其厚度为0.75<x_Ge<1,掺杂浓度为10^18 ~ 10^19 cm-3,位错密度为10^8 ~ 10^9 cm-2。P掺杂样品的Si-Ge互扩散率加快,是未掺杂样品的2-8倍。掺杂的硅锗互扩散的依赖性建模的费米增强因子。结果表明,在所研究的条件下,Si-Ge互扩散系数与n^2/n_i^2成正比,这表明在高Ge含量范围内,n型掺杂的Si-Ge互扩散以V^(2-)缺陷为主。的费米增强因子被证明有一个相对较弱的依赖于温度和Ge分数。研究结果对n型掺杂Ge/Si和Ge/SiGe基器件(如Ge/Si激光器)的结构和热处理条件设计具有指导意义。

英文摘要:

Si-Ge interdiffusion with a high phosphorus doping level was investigated by both experiments and modeling. Ge/Si1-xGex/Ge multi-layer structures with 0.75<x_Ge<1 , a mid-10^18 to low-10^19 cm-3 P doping and a dislocation density of 10^8 to 10^9 cm-2 range were studied. The P-doped sample shows an accelerated Si-Ge interdiffusivity, which is 2-8 times of that of the undoped sample. The doping dependence of the Si-Ge interdiffusion was modelled by a Fermi-enhancement factor. The results show that Si-Ge interdiffusion coefficient is proportional to n^2/n_i^2 for the conditions studied, which indicates that the interdiffusion in high Ge fraction range with n-type doping is dominated by V^(2-) defects. The Fermi-enhancement factor was shown to have a relatively weak dependence on the temperature and the Ge fraction. The results are relevant to structure and thermal processing condition design of n-type doped Ge/Si and Ge/SiGe based devices such as Ge/Si lasers.

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