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arXiv 1504.03351cond-mat.mtrl-sci
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长距离间隙迁移形成的不同形状的杂质浓度剖面

Different shapes of impurity concentration profiles formed by long-range interstitial migration

O. I. Velichko

摘要:

本文提出了一个间隙杂质迁移模型,解释了低温退火过程中注入硼的再分布现象。认为非平衡态的硼化物是在离子注入过程中或热处理初期产生的,在退火的基本阶段,硼化物向内迁移并到达半导体表面。结果表明,硼浓度对数轴分布中的“尾”的形状从杂质元素平均寿命远小于退火时间时的直线变为向上弯曲以增加寿命的曲线。计算出的杂质浓度分布与实验数据非常吻合,描述了注入硼在750摄氏度下退火1小时和在800摄氏度下退火35分钟的再分布。同时,自然地解释了“尾部”区域中硼原子不完全电激活的实验现象。

英文摘要:

A model of interstitial impurity migration is proposed which explains the redistribution of ion-implanted boron in low-temperature annealing of nonamorphized silicon layers. It is supposed that nonequilibrium boron interstitials are generated either in the course of ion implantation or at the initial stage of thermal treatment and that they migrate inward and to the surface of a semiconductor in the basic stage of annealing. It is shown that the form of the "tail" in the boron profile with the logarithmic concentration axis changes from a straight line if the average lifetime of impurity interstitials is substantially shorter than the annealing duration to that bending upwards for increasing lifetime. The calculated impurity concentration profiles are in excellent agreement with the experimental data describing the redistribution of implanted boron for low-temperature annealing at 750 Celsius degrees for 1 h and at 800 Celsius degrees for 35 min. Simultaneously, the experimental phenomenon of incomplete electrical activation of boron atoms in the "tail" region is naturally explained.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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