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arXiv 1504.01082cond-mat.mtrl-sci
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声子玻璃晶体中低维电输运增强热电优值

Enhancing thermoelectric figure-of-merit by low-dimensional electrical transport in phonon-glass crystals

Xue-Ya Mi, Xiaoxiang Yu, Kai-Lun Yao, Xiaoming Huang, Nuo Yang, Jing-Tao Lü

摘要:

低维电子输运和玻璃态声子输运是高效热电材料的两个重要组成部分,由此产生了热电研究的两个分支。一个侧重于控制电子输运在低维,而另一个多尺度声子工程的散装。最近的工作从这两种方法的结合中受益匪浅,例如,低维材料中的声子工程在这里,我们建议采用体声子玻璃晶体中的低维电子结构作为提高热电效率的替代方法。通过第一性原理电子结构计算和经典分子动力学模拟,我们发现$π$ - $π$堆积的双二噻吩并噻吩分子晶体是一个天然的候选者。这是由其化学键的性质决定的。没有任何优化的材料参数,我们得到了最大的室温品质因数,$ZT$,$1.48$在最佳掺杂,从而验证了我们的想法。

英文摘要:

Low-dimensional electronic and glassy phononic transport are two important ingredients of highly-efficient thermoelectric material, from which two branches of the thermoelectric research emerge. One focuses on controlling electronic transport in the low dimension, while the other on multiscale phonon engineering in the bulk. Recent work has benefited much from combining these two approaches, e.g., phonon engineering in low-dimensional materials. Here, we propose to employ the low-dimensional electronic structure in bulk phonon-glass crystal as an alternative way to increase the thermoelectric efficiency. Through first-principles electronic structure calculation and classical molecular dynamics simulation, we show that the $π$-$π$ stacking Bis-Dithienothiophene molecular crystal is a natural candidate for such an approach. This is determined by the nature of its chemical bonding. Without any optimization of the material parameter, we obtain a maximum room-temperature figure of merit, $ZT$, of $1.48$ at optimal doping, thus validating our idea.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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