Explicit expressions, for efficient application in engineering practice, are derived for generalized displacements and stresses in simply supported multi-layered wide plates and beams subjected to steady-state thermal and mechanical loading. The expressions are general and apply to plates composed of an arbitrary number of layers, of arbitrary thickness and elastic/thermal properties, and where the interfaces between the layers may be imperfect and allow relative sliding. The closed-form solutions are obtained using a multiscale homogenized model which depends on only three displacement variables and overcomes limitations of current approaches based on computationally expensive discrete-layer models. The accuracy of the expressions in predicting the highly complex and discontinuous fields, which characterize the response of thick and highly anisotropic plates with interlayer damage and delaminations, is verified using exact 2D thermo-elasticity solutions. The asymptotic limits of the model/solution correspond to the problems of an intact and a multiply delaminated plate. They are derived using a perturbation technique, which also explains the multiscale dependence of the model on the parameters.
Polyaniline and graphene nanocomposites for enhancing the interlaminar fracture toughness and thermo-mechanical properties of carbon fiber/epoxy composites
Structural, elastic, bonding, optoelectronic, and some thermo-physical properties of transition metal dichalcogenides ZrX2 (X = S, Se, Te): Insights from ab-initio calculations
Structural, elastic, electronic, bonding, thermo-mechanical and optical properties of predicted NbAlB MAB phase in comparison to MoAlB: DFT based ab-initio insights
Ab-initio insights into the structural, elastic, bonding, and thermophysical properties of UHx (x = 1, 2, 3, 5, 6, 7, 8) under pressure: possible relevance to high-Tc superconductivity
Accelerating Discovery of Extreme Lattice Thermal Conductivity by Crystal Attention Graph Neural Network (CATGNN) Using Chemical Bonding Intuitive Descriptors
Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process
School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University（北京大学集成电路学院与北京集成电路先进创新中心）；School of Integrated Circuits, Southeast University（东南大学集成电路学院）
A comprehensive ab-initio insights into the pressure dependent mechanical, phonon, bonding, electronic, optical, and thermal properties of CsV3Sb5 Kagome compound
A ReaxFF-based thermomechanical analysis of N-carbophenes: phase-change, thermal expansion, and high temperature synthesis pathway
University of Hawai‘i at Mānoa（夏威夷大学马诺阿分校）；Phil and Penny Knight Campus for Accelerating Scientific Impact（菲尔和佩妮·奈特加速科学影响校园）；Dotquant LLC（Dotquant有限责任公司）；Department of Biochemistry, University of Washington（华盛顿大学生物化学系）；University of Hawai‘i Maui College（夏威夷大学茂宜学院）；New Mexico State University（新墨西哥州立大学）；Universidade Estadual Paulista, UNESP（圣保罗州立大学）；Pennsylvania（宾夕法尼亚）
