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arXiv 1303.3772cond-mat.mtrl-scicond-mat.other
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多晶NiSi3P4的热电性能

Thermoelectric Properties of Polycrystalline NiSi3P4

Andrew F. May, Michael A. McGuire, Hsin Wang

摘要:

在2 ~ 775 K温度范围内对多晶NiSi_3 P_4的霍尔系数、塞贝克系数、电阻率和热导率进行了表征。未掺杂的NiSi_3 P_4是一种窄禁带半导体,在室温以下具有激活电阻率ρ,在300 K时具有大的Seebeck系数~ 400 uV/K。用硼取代硅的尝试导致了非本征空穴的产生,产生了ρ随温度升高而增加的中度杂质半导体行为,温度高于~ 150\,K。霍尔载流子密度在200 K时被限制在约5 × 10 ^{19}/cm ^3,这表明如果硼确实被掺入晶格中,则达到了硼的溶解度极限。这些非本征样品在300 K下的霍尔迁移率为12 cm ^2/V/s,抛物线带等效有效质量为自由电子质量的3.5倍。在700 K时,热电优值系数zT达到~0.1。热电性能的进一步改善将需要达到更高的载流子密度,以及进一步降低晶格热导率的机制,其在700 K下为~ 5 W/m/K。在Ge合金化的结果在低温下的热导率略有降低,在较高的温度下观察到的影响不大。

英文摘要:

The Hall and Seebeck coefficients, electrical resistivity and thermal conductivity of polycrystalline NiSi3P4 were characterized from 2 to 775K. Undoped NiSi3P4 behaves like a narrow gap semiconductor, with activated electrical resistivity ρbelow room temperature and a large Seebeck coefficient of ~400uV/K at 300K. Attempts to substitute boron for silicon resulted in the production of extrinsic holes, yielding moderately-doped semiconductor behavior with ρincreasing with increasing temperature above ~150\,K. Hall carrier densities are limited to approximately 5x10^{19}/cm^3 at 200K, which would suggest the solubility limit of boron is reached if boron is indeed incorporated into the lattice. These extrinsic samples have a Hall mobility of ~12cm^2/V/s at 300K, and a parabolic band equivalent effective mass of ~3.5 times the free electron mass. At 700,K, the thermoelectric figure of merit zT reaches ~0.1. Further improvements in thermoelectric performance would require reaching higher carrier densities, as well as a mechanism to further reduce the lattice thermal conductivity, which is ~5W/m/K at 700K. Alloying in Ge results in a slight reduction of the thermal conductivity at low temperatures, with little influence observed at higher temperatures.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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