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arXiv 1208.1835cond-mat.mtrl-scicond-mat.mes-hall
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石墨烯上的无无序溅射方法

Disorder-free sputtering method on graphene

Xue Peng Qiu, Young Jun Shin, Jing Niu, Narayanapillai Kulothungasagaran, Gopinadhan Kalon, Caiyu Qiu, Ting Yu, Hyunsoo Yang

摘要:

将各种材料沉积到石墨烯上而不引起任何无序对于石墨烯应用是高度期望的。特别是,溅射是一种多用途的技术,可以沉积用于自旋电子学的各种金属和绝缘体,以及用于制造透明器件的氧化铟锡。然而,溅射过程由于高能量溅射原子而对石墨烯造成损伤。通过翻转衬底和使用高Ar压力,我们证明了在DC,RF和反应溅射工艺中可以减少或消除对石墨烯的损伤水平。

英文摘要:

Deposition of various materials onto graphene without causing any disorder is highly desirable for graphene applications. Especially, sputtering is a versatile technique to deposit various metals and insulators for spintronics, and indium tin oxide to make transparent devices. However, the sputtering process causes damage to graphene because of high energy sputtered atoms. By flipping the substrate and using a high Ar pressure, we demonstrate that the level of damage to graphene can be reduced or eliminated in dc, rf, and reactive sputtering processes.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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