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arXiv 1107.3891cond-mat.mes-hall
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表面结构和振动模式对铜膜电阻率的影响

Influence of the Surface Structure and Vibration Mode on the Resistivity of Cu Films

Ya-Ni Zhao, Shi-Xian Qu, Ke Xia

摘要:

研究了铜膜的表面结构和振动模式对铜膜电阻率的影响以及相应的尺寸效应。基于紧束缚线性muffin-tin轨道方法和格林函数技术的算法计算了不同表面形貌的薄膜的温度依赖性电导率。热效应是通过设置原子位移按照高斯分布与德拜模型估计的均方振幅。结果表明,表面原子的振动对体系的电阻率有显著的贡献。通过比较三种不同振动模式下的电导率,提出了在实际应用中需要冻结表面振动,以降低表面电子-声子散射引起的电阻率。

英文摘要:

The influence of the surface structure and vibration mode on the resistivity of Cu films and the corresponding size effect are investigated. The temperature dependent conductivities of the films with different surface morphologies are calculated by the algorithm based upon the tight-binding linear muffin-tin orbital method and the Green's function technique. The thermal effect is introduced by setting the atomic displacements according to the Gaussian distribution with the mean-square amplitude estimated by the Debye model. The result shows that the surface atomic vibration contributes significantly to the resistivity of the systems. Comparing the conductivities for three different vibration modes, it is suggested that freezing the surface vibration is necessary for practical applications to reduce the resistivity induced by the surface electron-phonon scattering.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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