表面活性剂诱导的Cu/Co多层膜光滑对称界面
Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers
摘要：
在这项工作中，我们研究了银表面活性剂诱导的Cu/Co多层膜的生长。采用离子束溅射技术，以Ag为表面活性剂，制备了Cu/Co多层膜。结果发现，Ag表面活性剂平衡了Cu和Co表面自由能的不对称性，使Co-on-Cu和Cu-on-Co界面变得尖锐而对称，从而提高了多层膜的热稳定性。在此基础上，讨论了Cu/Co多层膜中形成对称稳定界面的机制。
英文摘要：
In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energy of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.
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