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arXiv 1012.2937cond-mat.mes-hall
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悬浮单层石墨烯中的声子输运

Phonon Transport in Suspended Single Layer Graphene

Xiangfan Xu, Yu Wang, Kaiwen Zhang, Xiangming Zhao, Sukang Bae, Martin Heinrich, Cong Tinh Bui, Rongguo Xie, John T. L. Thong, Byung Hee Hong, Kian Ping Loh, Ba… 展开作者

Xiangfan Xu, Yu Wang, Kaiwen Zhang, Xiangming Zhao, Sukang Bae, Martin Heinrich, Cong Tinh Bui, Rongguo Xie, John T. L. Thong, Byung Hee Hong, Kian Ping Loh, Baowen Li, Barbaros Oezyilmaz

摘要:

我们报道了第一次在悬浮Cu-CVD单层石墨烯(SLG)的温度依赖的声子输运测量从15 K到380 K使用微制造的悬浮设备。由于Umklapp过程,单位截面$σ$ /A的热导率随温度的升高而增大,并在T~ 280 K($\pm$ 10 K)附近出现峰值。在低温(T<140 K)下,热导率随温度的变化关系为~T^{1.5},表明悬浮SLG中的弯曲声学(ZA)声子对热导率的贡献最大。$σ$ /A达到1.7 $\times10^5 T^{1.5}$ W/m^2 K的高值,这接近二维石墨烯片的预期弹道声子热导率。我们的研究结果不仅澄清了热导率的模糊性,而且还证明了Cu-CVD石墨烯在热相关应用中的潜力。

英文摘要:

We report the first temperature dependent phonon transport measurements in suspended Cu-CVD single layer graphene (SLG) from 15K to 380K using microfabricated suspended devices. The thermal conductance per unit cross section $σ$/A increases with temperature and exhibits a peak near T~280K ($\pm$10K) due to the Umklapp process. At low temperatures (T<140K), the temperature dependent thermal conductivity scales as ~T^{1.5}, suggesting that the main contribution to thermal conductance arises from flexural acoustic (ZA) phonons in suspended SLG. The $σ$/A reaches a high value of 1.7$\times10^5 T^{1.5}$ W/m^2K, which is approaching the expected ballistic phonon thermal conductance for two-dimensional graphene sheets. Our results not only clarify the ambiguity in the thermal conductance, but also demonstrate the potential of Cu-CVD graphene for heat related applications.

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