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arXiv 1002.2579cond-mat.mtrl-scicond-mat.other
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半导体合金中的带隙和能带弯曲

Bandgaps and band bowing in semiconductor alloys

Titus Sandu, Radu I. Iftimie

摘要:

本文用一种快速、实用的方法计算了半导体合金的带隙和能带弯曲参数。该方法是一个介电缩放近似的基础上,一个近似。它增加了一个能移的带隙所提供的局域密度近似(LDA)的密度泛函理论(DFT)。能量位移由高频介电常数的倒数加权的材料无关常数组成。该方法的显著特点是通过紧束缚线性松饼-锡轨道(TB-LMTO)的格林函数(GF)在原子球近似(ASA)下快速计算合金的介电常数。当将其应用于高度失配的半导体合金(HMA)(如Zn Te $_x$ Se $_{1-x}$)时,该方法提供了与用LDA计算的带弯曲参数不同的带弯曲参数,这是由于高频介电常数也表现出弯曲。

英文摘要:

The bandgap and band bowing parameter of semiconductor alloys are calculated with a fast and realistic approach. The method is a dielectric scaling approximation that is based on a scissor approximation. It adds an energy shift to the bandgap provided by the local density approximation (LDA) of the density functional theory (DFT). The energy shift consists of a material-independent constant weighted by the inverse of the high-frequency dielectric constant. The salient feature of the approach is the fast calculation of the dielectric constant of alloys via the Green function (GF) of the TB-LMTO (tight-binding linear muffin-tin orbitals) in the atomic sphere approximation (ASA). When it is applied to highly mismatched semiconductor alloys (HMAs) like Zn Te$_x$ Se$_{1-x}$, this method provides a band bowing parameter that is different from the band bowing parameter calculated with the LDA due to the bowing exhibited also by the high-frequency dielectric constant.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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