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arXiv 0804.3547cond-mat.mtrl-sci
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3C- SiC的路径积分分子动力学模拟

Path-integral molecular dynamics simulation of 3C-SiC

Rafael Ramirez, Carlos P. Herrero, Eduardo R. Hernandez, Manuel Cardona

摘要:

采用分子动力学模拟研究了3C-SiC在压力和温度作用下的力学行为。这些模拟处理电子和原子核的量子力学方法。当固体的电子结构由一个有效的紧束缚哈密顿量描述时,核动力学由统计力学的路径积分公式处理。为了评估核量子效应的相关性,将量子模拟的结果与其中Si核、C核或两个原子核都被视为经典粒子的其他结果进行比较。我们发现,实验热膨胀的3C-SiC的真实再现我们的模拟。计算得到的3C-SiC的体积弹性模量及其压力导数在室温下也显示出良好的协议与现有的实验数据。电子-声子相互作用对3C-SiC的直接电子能隙的影响已被计算为温度的函数,并与大块金刚石和Si的结果有关。比较现有的实验数据显示令人满意的协议,虽然我们观察到,所采用的紧束缚模型往往高估的大小的电子-声子相互作用。研究了将原子核作为经典粒子处理对3C-SiC直接带隙的影响。我们发现,与原子质量相关的非线性量子效应在低于250 K的温度下特别相关。

英文摘要:

Molecular dynamics simulations of 3C-SiC have been performed as a function of pressure and temperature. These simulations treat both electrons and atomic nuclei by quantum mechanical methods. While the electronic structure of the solid is described by an efficient tight-binding Hamiltonian, the nuclei dynamics is treated by the path integral formulation of statistical mechanics. To assess the relevance of nuclear quantum effects, the results of quantum simulations are compared to others where either the Si nuclei, the C nuclei or both atomic nuclei are treated as classical particles. We find that the experimental thermal expansion of 3C-SiC is realistically reproduced by our simulations. The calculated bulk modulus of 3C-SiC and its pressure derivative at room temperature show also good agreement with the available experimental data. The effect of the electron-phonon interaction on the direct electronic gap of 3C-SiC has been calculated as a function of temperature and related to results obtained for bulk diamond and Si. Comparison to available experimental data shows satisfactory agreement, although we observe that the employed tight-binding model tends to overestimate the magnitude of the electron-phonon interaction. The effect of treating the atomic nuclei as classical particles on the direct gap of 3C-SiC has been assessed. We find that non-linear quantum effects related to the atomic masses are particularly relevant at temperatures below 250 K.

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