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arXiv 0712.3101cond-mat.mtrl-sci
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三维各向同性微结构的刚度和电导率最大化设计

Design of three dimensional isotropic microstructures for maximized stiffness and conductivity

V. J. Challis, A. P. Roberts, A. H. Wilkins

摘要:

采用拓扑优化中的水平集方法对三维各向同性两相周期性多功能复合材料进行了优化设计。一个相是刚性的和绝缘的,而另一个相是导电的和机械顺应的。优化目标是使复合材料的有效体积模量和电导率的线性组合最大化。具有Schwartz原始表面和金刚石最小表面作为相界面的复合材料已被证明具有最大的体积模量和电导率。由于这些复合材料不是弹性各向同性的,它们在单轴载荷下的刚度随载荷方向而变化。一个各向同性的复合材料,提出了类似的导电性,这是至少23%的单轴加载时,沿其最弱的方向单轴加载时,比施瓦茨结构的单轴载荷下的刚度。提出了其它新的近优各向同性复合材料,证明了水平集方法用于微结构设计的能力。

英文摘要:

The level-set method of topology optimization is used to design isotropic two-phase periodic multifunctional composites in three dimensions. One phase is stiff and insulating whereas the other is conductive and mechanically compliant. The optimization objective is to maximize a linear combination of the effective bulk modulus and conductivity of the composite. Composites with the Schwartz primitive and diamond minimal surfaces as the phase interface have been shown to have maximal bulk modulus and conductivity. Since these composites are not elastically isotropic their stiffness under uniaxial loading varies with the direction of the load. An isotropic composite is presented with similar conductivity which is at least 23% stiffer under uniaxial loading than the Schwartz structures when loaded uniaxially along their weakest direction. Other new near-optimal isotropic composites are presented, proving the capablities of the level-set method for microstructure design.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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