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arXiv 2606.08042physics.ins-det
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ALICE ITS3升级概述

Overview of the ALICE ITS3 Upgrade

Department of Physics and Astronomy, Sejong University(世宗大学物理与天文学系)

Naseem Bouchhar

AI总结:

ALICE将在LHC第三次停机期间用ITS3替换最内三层跟踪探测器,采用65nm CMOS工艺的弯曲单片有源像素传感器,实现无支撑结构、空气冷却,材料预算低于0.09%X$_0$每层。

摘要:

ALICE实验将在LHC第三次长期停机期间,用内部跟踪系统3(ITS3)替换其最内三层跟踪探测器。此次升级引入了首个全圆柱形、晶圆级硅顶点探测器,采用65nm CMOS工艺制造的单片有源像素传感器(MAPS)。通过将传感器减薄至50$μ$m并弯曲至小至19mm的半径,设计实现了自支撑结构,消除了传统支撑材料。晶圆级拼接实现了27cm长的无缝传感器,集成了电源和信号分配,消除了有源体积内的柔性印刷电路。这些创新,加上从水冷到空气冷却的转变,将材料预算降低至每层低于0.09%X$_0$。研发计划已通过全尺寸原型(MOSS、MOST)验证,证明了拼接可行性、高产量和辐射硬度。工程模型证实了空气对流冷却的可行性,表明了有效的热管理和结构稳定性。本文总结了拼接传感器开发、机械集成以及通往最终鉴定模型的关键进展。

英文摘要:

The ALICE experiment will replace its three innermost tracking layers with the Inner Tracking System 3 (ITS3) during LHC Long Shutdown 3. This upgrade introduces the first fully cylindrical, wafer-scale silicon vertex detector, utilising Monolithic Active Pixel Sensors (MAPS) fabricated in a 65nm CMOS process. By thinning sensors to 50$μ$m and bending them to radii as small as 19mm, the design achieves a self-supporting structure that eliminates traditional support material. Wafer-scale stitching enables 27cm-long seamless sensors with integrated power and signal distribution, removing the need for flexible printed circuits within the active volume. These innovations, combined with a move from water to air cooling, reduce the material budget to less than 0.09%X$_0$ per layer. The R&D program has been validated through full-scale prototypes (MOSS, MOST), which demonstrated stitching feasibility, high yield, and radiation hardness. Engineering models confirmed the feasibility of air-convection cooling, indicating effective thermal management and structural stability. This contribution summarises the key advances in stitched sensor development, mechanical integration, and the path toward the final qualification model.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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