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arXiv 2602.03504physics.ins-det
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ALICE ITS3升级用缝合原型芯片的特性分析

Characterization of Stitched Prototypes Chip for the ALICE ITS3 Upgrade

University of Padova(帕多瓦大学);Istituto Nazionale di Fisica Nucleare, Sezione di Padova(意大利国家核物理研究所,帕多瓦分部)

Michele Rignanese

AI总结:

ALICE ITS3升级采用缝合单片传感器技术,通过测试束验证其高探测效率和优异空间分辨率。

摘要:

在LHC长停机3期间,ALICE实验将其内层跟踪系统(ITS2)的三个最内层替换为新的顶点探测器ITS3。该新探测器将使用基于65nm CMOS工艺的晶圆级缝合单片主动像素传感器(MAPS)进行组装,这些传感器将被减薄并弯曲以形成真正的圆柱形层围绕束流管。为了验证新技术,开发了几种原型并进行了广泛表征。本工作聚焦于2024年9月在欧洲核子研究中心(CERN)PS进行的测试束活动的结果,使用10 GeV介子束流,以估算babyMOSS原型的探测效率和空间分辨率,该原型是单片缝合传感器(MOSS)的较小版本。对非辐照和辐照芯片进行了测试,结果证实原型满足ITS3要求,显示出超过99%的探测效率,假击中率低于每像素每事件10^-6,空间分辨率为约5微米。

英文摘要:

During LHC Long Shutdown 3, the ALICE experiment will replace the three innermost layers of its Inner Tracking System (ITS2) with a new vertex detector, the ITS3. This new detector will be assembled using wafer-scale, stitched Monolithic Active Pixel Sensors (MAPS) fabricated using a 65nm CMOS technology node, which will be thinned and bent to form truly cylindrical layers around the beam pipe. To validate the new technology, several prototypes were developed and extensively characterized. This work focuses on the results of a test beam campaign performed at the CERN PS in September 2024, using a \SI{10}{\giga\eV} pion beam, to estimate detection efficiency and spatial resolution of the babyMOSS prototype, a smaller version of the MOnolithic Stitched Sensor (MOSS). Both non-irradiated and irradiated chips are tested, and the results confirm that the prototypes meet the ITS3 requirements, demonstrating a detection efficiency above 99\%, with a fake-hit rate below 10$^{-6}$ hits/pixel/event and a spatial resolution around \SI{5}{\micro\meter}.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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