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arXiv 2602.11508physics.opticsphysics.app-ph
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单次曝光超宽 aspect 比微结构全体积全息光刻

Single-exposure holographic lithography of ultra-high aspect-ratio microstructures

University of Utah(犹他大学)

Dajun Lin, Brian Baker, Rajesh Menon

AI总结:

单次曝光体光刻技术实现超宽 aspect 比3D微结构制造,最小特征尺寸6微米,aspect比超120:1,具备高吞吐量和机械坚固性。

摘要:

体光刻提供了一条实现复杂三维(3D)微纳结构可扩展制造的途径,但现有方法受限于近二维曝光物理或慢速串行写入。我们提出了一种单次曝光体制造策略,能够创建超宽 aspect 比的3D结构,最小特征尺寸为6微米。一个反向设计的体(全息)相位掩模生成在光刻胶体积内扩展深度场的强度分布,同时保持高横向分辨率,使整个体积在单次曝光中均匀聚合。曝光时间约为20秒,我们制造了晶格、Penrose铺砌和微机械元件,特征尺寸可降至6微米,体积达800x800x720微米立方,aspect比超过120:1。对空心晶格的毛细流动定量分析显示可控的流体传输,有效毛细流动系数为176.3微米/(毫秒)^{1/2}。原位纳米压痕基于微压缩揭示打印的3D六方紧密堆积晶格表现出明确的线性弹性区域,有效杨氏模量为5.7 GPa,随后出现逐步弯曲和致密化特征,是机械坚固的细胞结构。重叠、倾斜和多掩模曝光进一步使准3D复杂几何形状成为可能,具有重新配置潜力。这种方法建立了一种高吞吐量体制造的新范式。

英文摘要:

Volumetric lithography offers a path to scalable fabrication of complex three-dimensional (3D) micro- and nanoscale architectures, yet existing approaches are limited by quasi-two-dimensional exposure physics or slow serial writing. We present a single-exposure volumetric fabrication strategy that enables creation of ultrahigh-aspect-ratio 3D structures with 6 um minimum features. An inverse-designed volumetric (holographic) phase mask generates an extended-depth-of-field intensity distribution inside a photoresist volume while preserving high transverse resolution, enabling uniform polymerization of the full volume in a single exposure. With exposure times of approximately 20 s, we fabricate lattices, Penrose tilings, and micromechanical elements with feature sizes down to 6 um over volumes up to 800 x 800 x 720 um^3, achieving aspect ratios exceeding 120:1. Quantitative analysis of capillary flow in hollow lattices demonstrates controlled fluid transport with an effective capillary transport coefficient of 176.3 um/(ms)^(1/2). In situ nanoindentation-based micro-compression reveals that the printed 3D hexagonal close-packed lattices exhibit a well-defined linear elastic regime with an effective Young's modulus of 5.7 GPa, followed by progressive buckling and densification characteristic of mechanically robust cellular architectures. Overlapping, tilted and multi-mask exposures further enable quasi-3D complex geometries with potential for reconfigurability. This approach establishes a new regime of high-throughput volumetric fabrication.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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