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arXiv 2502.04071hep-exphysics.ins-det
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FCC-ee 的顶点探测挑战

The vertexing challenge at FCC-ee

Armin Ilg, Anna Macchiolo, Fabrizio Palla

AI总结:

本文针对 FCC-ee 对撞机对顶点探测的极高精度要求,系统分析了顶点探测器在撞击参数分辨率、物质量预算和功耗方面的约束,并综述了 CMOS 单片有源像素传感器(MAPS)技术及原型作为满足这些要求的关键方案。

摘要:

继大型强子对撞机(LHC)之后,未来环形对撞机(FCC)计划成为下一个跨代对撞机项目。在第一阶段,FCC-ee 将在 88 至 365 GeV 的质心能量下对撞高强度电子束与正电子束,使其成为电弱、味物理、希格斯和顶夸克工厂。前所未有的统计精度要求 FCC-ee 实验将系统不确定度限制到最低限度。相互作用顶点的精确重建对 FCC-ee 的大多数测量至关重要,例如稀有味物理过程以及希格斯粒子和 Z 玻色子衰变到底夸克、粲夸克和 τ 轻子的测量。本文讨论 FCC-ee 顶点探测器的要求,从 Z 极点处具有挑战性的对撞环境下所需的撞击参数分辨率,到对物质量预算的严格要求——每探测层应保持在 0.3% 辐射长度以下。随后简要介绍为 FCC-ee 提出的顶点探测器设计方案,并对新型探测器设计和特性进行展望。顶点性能要求转化为对顶点探测器所用传感器的要求。如本文所述,传感器需要具备约 3 μm 的空间分辨率,并提供 O(ns-μs) 量级的时间信息,同时将功耗降至最低,以便对探测器进行空气冷却——从而最小化探测器物质量预算。唯一有希望满足此类要求的传感器类型是 CMOS 单片有源像素传感器(MAPS),它将信号产生、放大和读出集成在单个硅晶片上。因此,本文其余部分将概述现有和计划中的 MAPS 技术与原型,旨在满足严格的 FCC-ee 顶点探测器要求。

英文摘要:

Following in the footsteps of the LHC, the Future Circular Collider (FCC) plans to be the next multi-generational collider project. In the first stage, FCC-ee will collide intense beams of electrons and positrons at centre of mass energies between 88 and 365 GeV, making it an electroweak, flavour, Higgs and top factory. The unprecedented statistical precision requires FCC-ee experiments to limit their systematic uncertainties to the very minimum. The precise reconstruction of the interaction vertices is central to most measurements at FCC-ee, such as rare flavour physics processes and the measurement of Higgs and Z decays to bottom and charm quarks and taus. This contribution will discuss the requirements of FCC-ee vertex detectors, from the necessary impact parameter resolution via the challenging collision environment at the Z pole to the tight requirement on the material budget, which should be kept below 0.3% of a radiation length per detection layer. Next, the proposed vertex detector designs for FCC-ee are shortly presented, and an outlook is given on novel detector designs and features. The requirements for the vertexing performance translate into requirements for the sensors used for the vertex detector. As discussed in this contribution, they need to feature a spatial resolution of about 3 $μ$m and provide timing information of O(ns-$μ$s) while keeping power consumption minimal to allow for air-cooling of the detector - minimising the detector material budget. The only type of sensor capable of aiming to fulfil such requirements are CMOS Monolithic Active Pixel Sensors (MAPS), which combine signal generation, amplification and readout into a single silicon die. Therefore, the rest of this contribution will present an overview of existing and planned MAPS technologies and prototypes aiming to fulfil the stringent FCC-ee vertex detector requirements.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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