AI 中文总结
本文综述未来各类对撞机顶点与径迹探测器的要求挑战，指出需优化多系统并研发耐受辐射等的新型探测器以满足需求。
AI 中文摘要
精确且高效的径迹与顶点重建对于发挥对撞机实验的物理潜力至关重要。未来径迹系统的要求由对撞机类型、其碰撞环境、所需测量精度以及束流结构决定。本文综述了未来正负电子对撞机（e⁺e⁻）、电子-强子对撞机（e⁻-hadron）、缪子对撞机（μ⁺μ⁻）和强子对撞机的顶点与径迹探测器的要求和挑战。不同类型对撞机呈现出若干共同趋势：径迹系统需要日益精确的空间测量、低材料设计，部分情况下还需要集成粒子鉴别能力；单片有源像素传感器目前是正负电子对撞机和电子-强子对撞机顶点探测器的首选；径迹探测器概念涵盖每根径迹可提供多次测量且能实现极低材料预算的气体探测器，以及测量次数较少但精度更高、可耐受更高 hit 率的硅探测器和闪烁光纤径迹探测器；在质心系能量为10 TeV的部分子对撞机中，整个径迹系统需要精确计时以用于束流本底抑制或堆积效应缓解；对于未来强子对撞机，需要现有传感器技术未达到的辐射耐受性。最终，满足未来对撞机的顶点与径迹要求需要大量研发工作，并对传感器、前端电子学、读出、冷却、供电和机械结构进行集成优化。
英文摘要
Precise and efficient track and vertex reconstruction is essential to exploit the physics potential of collider experiments. The requirements of future tracking systems are determined by the collider type and its collision environment, required measurement precision, and beam structure. This contribution reviews the requirements and challenges of vertexing and tracking detectors at future $e^+e^-$, $e^-$-hadron, $μ^+μ^-$, and hadron colliders. Several common trends emerge across the different collider types. Tracking systems require increasingly precise spatial measurements, low-material designs, and, in some cases, integrated particle identification capabilities. Monolithic active pixel sensors are currently the leading option for vertex detectors at $e^+e^-$ and $e^-$-hadron colliders. Tracker concepts range from gaseous detectors, which provide many measurements per track and can achieve very low material budgets, to silicon and scintillating-fibre trackers, which provide fewer but more precise measurements and can tolerate higher hit rates. At 10 TeV parton centre-of-mass colliders, precision timing throughout the tracking system is needed for beam-background rejection or pile-up mitigation. For future hadron colliders specifically, radiation tolerance beyond that demonstrated by existing sensor technologies is required. Ultimately, meeting the vertexing and tracking requirements of future colliders will require substantial R&D and the integrated optimisation of sensors, front-end electronics, readout, cooling, powering, and mechanics.
Comments4 pages, LHCP 2026 conference proceeding pre-print
