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arXiv 2408.04827cs.RO
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迈向增材制造中的智能协作机器人:过去、现在与未来

Towards Intelligent Cooperative Robotics in Additive Manufacturing: Past, Present and Future

University of Connecticut(康涅狄格大学);University of Illinois Chicago(芝加哥伊利诺伊大学)

Sean Rescsanski, Rainer Hebert, Azadeh Haghighi, Jiong Tang, Farhad Imani

AI总结:

本文综述C-RAM平台在增材制造中的系统控制、缺陷缓解、先进传感与数字孪生技术,并展望下一代智能协作机器人系统的发展方向。

摘要:

通过集成协作机器人增材制造(C-RAM)平台,增材制造(AM)技术取得了显著进展。通过将AM工艺部署在多个机械臂的末端执行器上,不仅规避了构建体积有限等传统约束,还使系统实现了更快的制造速度、协作感知能力以及原位多材料沉积。尽管取得了进展,挑战依然存在,尤其是在缺陷产生方面,包括孔隙、裂纹和残余应力。多种因素导致这些问题,包括刀具路径规划(即切片策略)、用于协作打印的零件分解以及运动规划(即路径和轨迹规划)。本综述首先考察了由切片和运动规划组成的C-RAM系统系统控制的关键方面。随后,在这些方面如何改变AM工艺的背景下,描述了通过调整这些方面以及AM方法的工艺参数来缓解缺陷的方法:预处理、层间(即层暂停期间)和层中(即材料沉积期间)。文中探讨了先进传感技术的应用,包括高分辨率相机、激光扫描仪和热成像,以促进捕获微观、细观和宏观尺度的缺陷。分析了数字孪生的作用,强调其模拟和预测制造结果的能力,从而实现预防性调整以防止缺陷。最后,概述了开发下一代C-RAM系统的前景和未来机遇。

英文摘要:

Additive manufacturing (AM) technologies have undergone significant advancements through the integration of cooperative robotics additive manufacturing (C-RAM) platforms. By deploying AM processes on the end effectors of multiple robotic arms, not only are traditional constraints such as limited build volumes circumvented, but systems also achieve accelerated fabrication speeds, cooperative sensing capabilities, and in-situ multi-material deposition. Despite advancements, challenges remain, particularly regarding defect generation including voids, cracks, and residual stress. Various factors contribute to these issues, including toolpath planning (i.e., slicing strategies), part decomposition for cooperative printing, and motion planning (i.e., path and trajectory planning). This review first examines the critical aspects of system control for C-RAM systems comprised of slicing and motion planning. The methods for the mitigation of defects through the adjustment of these aspects and the process parameters of AM methods are then described in the context of how they modify the AM process: pre-process, inter-layer (i.e., during layer pauses), and mid-layer (i.e., during material deposition). The application of advanced sensing technologies, including high-resolution cameras, laser scanners, and thermal imaging, to facilitate the capture of micro, meso, and macro-scale defects is explored. The role of digital twins is analyzed, emphasizing their capability to simulate and predict manufacturing outcomes, enabling preemptive adjustments to prevent defects. Finally, the outlook and future opportunities for developing next-generation C-RAM systems are outlined.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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