通过多光子光刻和金属涂层制备的自由曲面太赫兹结构
Freeform terahertz structures fabricated by multi-photon lithography and metal coating
AI总结：
本研究提出一种利用多光子激光光刻结合定向金属沉积和3D打印遮挡结构的方法，制造了高性能毫米波和太赫兹自由曲面结构，展示了其在太赫兹互连、探针尖端和悬浮天线等器件上的颠覆性应用潜力。
摘要：
直写式多光子激光光刻（MPL）结合了纳米尺度上的最高分辨率和基本上无限的3D设计自由度。在过去的几年中，这项技术具有开创性的潜力已在多个应用领域得到证明，包括微机械、材料科学、微流控、生命科学以及光子学，其中原位打印的光学耦合元件为封装级系统集成提供了新的视角。然而，毫米波（mmW）和太赫兹（THz）器件尚未能利用MPL的独特优势，尽管相关器件和结构也能从3D自由曲面微加工中极大受益。这一背景下的一个关键挑战在于，功能性的mmW和THz结构需要具备高电导率和低介电损耗的材料，而这些材料无法通过多光子聚合进行结构化。在这项工作中，我们提出并实验演示了一种新颖的方法，该方法允许利用MPL来制造具有迄今未实现功能的高性能mmW和THz结构。我们的概念利用了原位打印的聚合物模板，通过高定向金属沉积技术对其进行选择性涂层，并结合精确对准的3D打印遮挡结构。由此产生的金属涂层自由曲面结构提供了高表面质量、低介电损耗以及可与块体材料值相媲美的电导率，同时适用于在平面mmW/THz电路上进行制造。我们通过展示一系列功能性THz结构（例如THz互连、探针尖端和悬浮天线）在实验上验证了我们概念的可行性。我们相信，我们的方法在mmW和THz技术领域提供了颠覆性潜力，并可能开启基于激光的3D制造的全新领域。
英文摘要：
Direct-write multi-photon laser lithography (MPL) combines highest resolution on the nanoscale with essentially unlimited 3D design freedom. Over the previous years, the groundbreaking potential of this technique has been demonstrated in various application fields, including micromechanics, material sciences, microfluidics, life sciences as well as photonics, where in-situ printed optical coupling elements offer new perspectives for package-level system integration. However, millimeter-wave (mmW) and terahertz (THz) devices could not yet leverage the unique strengths of MPL, even though the underlying devices and structures could also greatly benefit from 3D freeform microfabrication. One of the key challenges in this context is the fact that functional mmW and THz structures require materials with high electrical conductivity and low dielectric losses, which are not amenable to structuring by multi-photon polymerization. In this work, we introduce and experimentally demonstrate a novel approach that allows to leverage MPL for fabricating high-performance mmW and THz structures with hitherto unachieved functionalities. Our concept exploits in-situ printed polymer templates that are selectively coated through highly directive metal deposition techniques in combination with precisely aligned 3D-printed shadowing structures. The resulting metal-coated freeform structures offer high surface quality in combination with low dielectric losses and conductivities comparable to bulk material values, while lending themselves to fabrication on planar mmW/THz circuits. We experimentally show the viability of our concept by demonstrating a series of functional THz structures such as THz interconnects, probe tips, and suspended antennas. We believe that our approach offers disruptive potential in the field of mmW and THz technology and may unlock an entirely new realm of laser-based 3D manufacturing.
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