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arXiv 2303.01481quant-ph
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倒装芯片封装中的 Fluxonium 量子比特

Fluxonium Qubits in a Flip-Chip Package

Aaron Somoroff, Patrick Truitt, Adam Weis, Jacob Bernhardt, Daniel Yohannes, Jason Walter, Konstantin Kalashnikov, Mario Renzullo, Raymond A. Mencia, Maxim G. V… 展开作者

Aaron Somoroff, Patrick Truitt, Adam Weis, Jacob Bernhardt, Daniel Yohannes, Jason Walter, Konstantin Kalashnikov, Mario Renzullo, Raymond A. Mencia, Maxim G. Vavilov, Vladimir E. Manucharyan, Igor V. Vernik, Oleg Mukhanov

AI总结:

本文提出将 fluxonium 量子比特与经典控制读取芯片通过凸点键合构成倒装芯片 MCM,表征其相干性并实现无 DRAG 的 6 ns 高保真单比特门。

摘要:

Fluxonium 超导电路固有的强非谐性和长相干时间有利于量子信息处理。除了需要高质量的物理量子比特外,量子处理器还必须以尽量减小串扰和退相干的方式进行组装。本文报道了采用倒装芯片架构封装的 fluxonium 量子比特研究,其中经典控制与读取芯片通过凸点键合到量子芯片上,构成多芯片模块(MCM)。这种模块化方法能够改善量子比特与控制/读取元件之间的连接性,并实现彼此独立的制备工艺。我们表征了单个 fluxonium 量子比特的相干特性,使用 6 ns 微波脉冲(不含 DRAG)演示了高保真度单量子比特门,并确定了主要退相干机制,以改进所报道的结果。

英文摘要:

The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report work on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump-bonded to the quantum chip, forming a multi-chip module (MCM). The modular approach allows for improved connectivity between the qubits and control/readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high fidelity single-qubit gates with 6 ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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