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arXiv 2201.04933cond-mat.mtrl-scics.LG
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机器学习增强的高效椭圆偏振光谱建模

Machine Learning-enhanced Efficient Spectroscopic Ellipsometry Modeling

University of Texas at Dallas(德克萨斯大学达拉斯分校);University of Central Florida(中佛罗里达大学)

Ayush Arunachalam, S. Novia Berriel, Parag Banerjee, Kanad Basu

摘要:

近年来,机器学习(ML)在现实世界的大量应用中得到了广泛的采用,从计算机视觉到数据挖掘和药物发现。在本文中,我们利用ML来促进高效的薄膜制造,特别是原子层沉积(ALD)。为了在ALD工艺开发中取得进展,其用于产生薄膜,以及其随后在工业中的加速采用,必须理解潜在的原子工艺。为此,已经提出了用于监测膜生长的原位技术,例如光谱椭圆偏振法(SE)。然而,原位SE与复杂的硬件相关联,因此是资源密集型的。为了解决这些挑战,我们提出了一种基于ML的方法来加快膜厚估计。所提出的方法具有更快的数据采集,降低硬件的复杂性和更容易集成的光谱椭偏膜厚度沉积的原位监测的巨大影响。我们的实验结果涉及二氧化钛的SE表明,所提出的ML为基础的方法证实了有前途的厚度预测精度结果的88.76%内+/-1.5 nm和85.14%内+/-0.5 nm的间隔。此外,我们在较低的厚度下提供高达98%的准确度结果,这是对现有基于SE的分析的显著改进,从而使我们的解决方案成为薄膜厚度估计的可行选择。

英文摘要:

Over the recent years, there has been an extensive adoption of Machine Learning (ML) in a plethora of real-world applications, ranging from computer vision to data mining and drug discovery. In this paper, we utilize ML to facilitate efficient film fabrication, specifically Atomic Layer Deposition (ALD). In order to make advances in ALD process development, which is utilized to generate thin films, and its subsequent accelerated adoption in industry, it is imperative to understand the underlying atomistic processes. Towards this end, in situ techniques for monitoring film growth, such as Spectroscopic Ellipsometry (SE), have been proposed. However, in situ SE is associated with complex hardware and, hence, is resource intensive. To address these challenges, we propose an ML-based approach to expedite film thickness estimation. The proposed approach has tremendous implications of faster data acquisition, reduced hardware complexity and easier integration of spectroscopic ellipsometry for in situ monitoring of film thickness deposition. Our experimental results involving SE of TiO2 demonstrate that the proposed ML-based approach furnishes promising thickness prediction accuracy results of 88.76% within +/-1.5 nm and 85.14% within +/-0.5 nm intervals. Furthermore, we furnish accuracy results up to 98% at lower thicknesses, which is a significant improvement over existing SE-based analysis, thereby making our solution a viable option for thickness estimation of ultrathin films.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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