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arXiv 2004.07428physics.app-ph
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热扩散成像:宽温区薄膜面内热导率测量

Heat Diffusion Imaging: In-Plane Thermal Conductivity Measurement of Thin Films in a Broad Temperature Range

T. Zhu, D. H. Olson, P. E. Hopkins, M. Zebarjadi

摘要:

这项工作结合了散热器的方法和热反射测量的成像能力的原则来测量薄膜的面内热导率,而不需要膜悬浮液或多个温度计沉积。我们将这种混合技术称为热扩散成像。热反射成像系统提供了整个薄膜表面的温度分布图。面内热导率可以从温度衰减曲线中提取。通过将系统与低温恒温器耦合,我们能够在40 K至400 K之间进行测量。测量了硅薄膜样品和无周期孔,并与平面时域热反射(TDTR)测量和文献数据进行了比较,作为热扩散成像的验证。

英文摘要:

This work combines the principles of the heat spreader method and imaging capability of the thermoreflectance measurements to measure the in-plane thermal conductivity of thin-films without the requirement of film suspension or multiple thermometer deposition. We refer to this hybrid technique as heat diffusion imaging. The thermoreflectance imaging system provides a temperature distribution map across the film surface. The in-plane thermal conductivity can be extracted from the temperature decay profile. By coupling the system with a cryostat, we were able to conduct measurements from 40 K to 400 K. Silicon thin film samples with and without periodic holes were measured and compared with in-plane time-domain thermoreflectance (TDTR) measurement and literature data as validation for heat diffusion imaging.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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