The Measurement of Position Resolution of RD53A Pixel Modules
Gang Zhang, Benjamin Nachman, Shi-Chieh Hsu, Xin Chen
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Talk presented at the 2019 Meeting of the Division of Particles and Fields of the American Physical Society (DPF2019), July 29 - August 2, 2019, Northeastern University, Boston, C1907293. The docker image of the analysis codes are on https://cernbox.cern.ch/index.php/s/AYlNnP9gbJLov4V
Position resolution is a key property of the innermost layer of the upgraded ATLAS and CMS pixel detectors for determining track reconstruction and flavor tagging performance. The 11 GeV electron beam at the SLAC End Station A was used to measure the position resolution of RD53A modules with a $50\times50$ and a $25\times100\ μ$m$^2$ pitch. Tracks are reconstructed from hits on telescope planes using the EUTelescope package. The position resolution is extracted by comparing the extrapolated track and the hit position on the RD53A modules, correcting for the tracking resolution. 10.9 and 6.8 $μ$m resolution can be achieved for the 50 and 25 $μ$m directions, respectively, with a 13 degree tilt.
The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase-II shutdown. A new silicon Inner Tracker (ITk) will contain five pixel layers equipped with new sensors and readout electronics capable to improve the tracking performance, cope with the high particle multiplicity and work in a high-luminosity environment. In order to standardize modules of the Inner Tracker, the idea of a common hybrid pixel module was introduced to be used in all regions of the detector. The common hybrid module assembly and testing techniques will be presented. The module construction, …
An eight chip InGrid module has been tested as readout of a prototype time projection chamber. The construction of the modules as well as first preliminary results are presented. The InGrids, a Micromegas like amplification structure with a pixel ASIC, have been produced on wafer-level in a photolithographic process. For the measurements a newly developed readout system based on the Scalable Readout System was used.
The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4…
For the barrel part of the CMS pixel tracker about 800 silicon pixel detector modules are required. The modules are bump bonded, assembled and tested at the Paul Scherrer Institute. This article describes the experience acquired during the assembly of the first ~200 modules.
For the high luminosity phase of the Large Hadron Collider to start operation around 2026, a major upgrade of the ATLAS Inner Tracker (ITk) is in preparation. Thanks to their low power dissipation and high charge-collection efficiency after irradiation, thin planar pixel modules are the baseline option to instrument all, except for the innermost layer of the pixel detector. To optimise the sensor layout for a pixel cell size of $50\times50\,μm^2$, TCAD simulations are being performed. Charge-collection efficiency, electronic noise and electrical-field properties are investigated. A radiation-d…
The ATLAS Forward Proton (AFP) detector is designed to identify events in which one or two protons emerge intact from the LHC collisions. AFP will consist of a tracking detector, to measure the momentum of the protons, and a time of flight system to reduce the background from multiple proton-proton interactions. Following an extensive qualification period, 3D silicon pixel sensors were selected for the AFP tracker. The sensors were produced at CNM (Barcelona) during 2014. The tracker module assembly and quality control was performed at IFAE during 2015. The assembly of the first AFP arm and th…
In view of the High Luminosity upgrade of the Large Hadron Collider (HL-LHC), planned to start around 2023-2025, the ATLAS experiment will undergo a replacement of the Inner Detector. A higher luminosity will imply higher irradiation levels and hence will demand more ra- diation hardness especially in the inner layers of the pixel system. The n-in-p silicon technology is a promising candidate to instrument this region, also thanks to its cost-effectiveness because it only requires a single sided processing in contrast to the n-in-n pixel technology presently employed in the LHC experiments. In…
The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the pixel detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The pre-production phase of such pixel modules has nearly finished, yielding fully…
The CMS pixel barrel system will consist of three layers built of about 800 modules. One module contains 66560 readout channels and the full pixel barrel system about 48 million channels. It is mandatory to test each channel for functionality, noise level, trimming mechanism, and bump bonding quality. Different methods to determine the bump bonding yield with electrical measurements have been developed. Measurements of several operational parameters are also included in the qualification procedure. Among them are pixel noise, gains and pedestals. Test and qualification procedures of the pixel …
In view of the high luminosity phase of the LHC (HL-LHC) to start operation around 2026, a major upgrade of the tracker system for the ATLAS experiment is in preparation. The expected neutron equivalent fluence of up to 2.4 * 1e16 1 MeV neq./cm2 at the innermost layer of the pixel detector poses the most severe challenge. Thanks to their low material budget and high charge collection efficiency after irradiation, modules made of thin planar pixel sensors are promising candidates to instrument these layers. To optimise the sensor layout for the decreased pixel cell size of 50 * 50 μm2, TCAD dev…
The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) to start operation in 2026. The most severe challenges are to be faced by the innermost layers of the pixel detector which will have to withstand a radiation fluence of up to $1.4\times10^{16}\,$n$_\text{eq}$/cm$^{2}$. Thin planar pixel modules are promising candidates to instrument these layers, thanks to the small material budget and their high charge collection efficiency after irradiation. Sensors of $100-200\,μ$m thickness, interconnected to FE-I4 read-out chips…
Both the current upgrades to accelerator-based HEP detectors (e.g. ATLAS, CMS) and also future projects (e.g. CEPC, FCC) feature large-area silicon-based tracking detectors. We are investigating the feasibility of using CMOS foundries to fabricate silicon radiation detectors, both for pixels and for large-area strip sensors. A successful proof of concept would open the market potential of CMOS foundries to the HEP community, which would be most beneficial in terms of availability, throughput and cost. In addition, the availability of multi-layer routing of signals will provide the freedom to o…
For operation at the High Luminosity Large Hadron Collider (LHC), the ATLAS experiment is building a new all-silicon inner tracker (ITk). The production and testing of thousands of silicon pixel and strip modules is required to cover the estimated 180 m$^{2}$ of the total surface area. A compact, affordable and robust module characterization system is required for in-situ testing prior any test beam campaign or installation. A test bench setup based on an infrared laser was developed at IJCLab, allowing also for the use of micro-metric precision scanning with a radioactive source. A detailed s…
Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bit, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 x 32 pixels of 200 um x 200 um pixel size. For a MCM the 4 chips are arranged in a 2 x 2 array which leads to a 64 x 64 sensor pixel geometry. The MCM construction is described, and the ima…
We prove and demonstrate here for the example of the large scale pixel detector of ATLAS that Serial Powering of pixel modules is a viable alternative and that has been devised and implemented for ATLAS pixel modules using dedicated on-chip voltage regulators and modified flex hybrids circuits. The equivalent of a pixel ladder consisting of six serially powered pixel modules with about 0.3Mpixels has been built and the performance with respect to noise and threshold stability and operation failures has been studied. We believe that Serial Powering in general will be necessary for future large …
In this paper a detailed simulation of irradiated pixel sensors was used to investigate the effects of radiation damage on charge sharing and position determination. The simulation implements a model of radiation damage by including two defect levels with opposite charge states and trapping of charge carriers. We show that charge sharing functions extracted from the simulation can be parameterized as a function of the inter-pixel position and used to improve the position determination. For sensors irradiated to Phi=5.9x10^14 n/cm^2 a position resolution below 15 um can be achieved after calibr…
For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.
Pixel detectors are used in the innermost part of the multi purpose experiments at LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of all detector components has thoroughly been tested up to the fluences expected at the LHC. In case of an LHC upgrade, the fluence will be much higher and it is not yet clear how long the present pixel modules will stay operative in such a harsh environment. The aim of this study was to establish such a limit as a benchmark for other possible …
We present the results of the characterization of pixel modules composed of 75 um thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration technologies. This module concept also envisages Inter-Chip-Vias (ICV) to extract the signals from the backside of the c…
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules …
We are investigating the feasibility of using CMOS foundries to fabricate silicon detectors, both for pixels and for large-area strip sensors. The availability of multi-layer routing will provide the freedom to optimize the sensor geometry and the performance, with biasing structures in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test-structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150$\,$nm CMOS process. This paper will focus on the characterization of irradiated and non-irradiated pixel modules, comp…
Ptychography, a form of Coherent Diffractive Imaging, is used with short wavelengths (e.g. X-rays, electron beams) to achieve high-resolution image reconstructions. One of the limiting factors for the reconstruction quality is the accurate knowledge of the illumination probe positions. Recently, many advances have been made to relax the requirement for the probe positions accuracy. Here, we analyze and demonstrate a straightforward approach that can be used to correct the probe positions with sub-pixel accuracy. Simulations and experimental results with visible light are presented in this work…
The moment method is an image analysis technique for sub-pixel estimation of particle positions. The total error in the calculated particle position includes effects of pixel locking and random noise in each pixel. Pixel locking, also known as peak locking, is an artifact where calculated particle positions are concentrated at certain locations relative to pixel edges. We report simulations to gain an understanding of the sources of error and their dependence on parameters the experimenter can control. We suggest an algorithm, and we find optimal parameters an experimenter can use to minimize …
The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. In this paper the system test setup and the operation of the readout chain is described. Also, some results of tests using the final pixel detector readout chain are giv…
The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 um. Using beam tests, the gain in hit efficiency is investigated as a funct…
Silicon pixel modules employing n-in-p planar sensors with an active thickness of 200 $μ$m, produced at CiS, and 100-200 $μ$m thin active/slim edge sensor devices, produced at VTT in Finland have been interconnected to ATLAS FE-I3 and FE-I4 read-out chips. The thin sensors are designed for high energy physics collider experiments to ensure radiation hardness at high fluences. Moreover, the active edge technology of the VTT production maximizes the sensitive region of the assembly, allowing for a reduced overlap of the modules in the pixel layer close to the beam pipe. The CiS production includ…
The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizi…
The Belle II experiment at the Super B factory SuperKEKB, an asymmetric $e^+e^-$ collider located in Tsukuba, Japan, is tailored to perform precision B physics measurements. The centre of mass energy of the collisions is equal to the rest mass of the $Υ(4S)$ resonance of $m_{Υ(4S)} = 10.58\,\rm GeV$. A high vertex resolution is essential for measuring the decay vertices of B mesons. Typical momenta of the decay products are ranging from a few tens of MeV to a few GeV and multiple scattering has a significant impact on the vertex resolution. The VerteX Detector (VXD) for Belle II is therefore d…
We demonstrate a scalable readout scheme for an infrared single-photon pulse-position camera consisting of WSi superconducting nanowire single-photon detectors (SNSPDs). For an N x N array, only 2 x N wires are required to obtain the position of a detection event. As a proof-of-principle, we show results from a 2 x 2 array.
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 $μ$m thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of $14\times10^{15}$ n$_{eq}$/cm$^2$. The charge collection and tracking efficiency of the …
The challenging conditions of the High-Luminosity LHC require tailored hardware designs for the trigger and data acquisition systems. The Apollo platform features a "Service Module" with a powerful system-on-module computer that provides standard ATCA communications and application-specific "Command Module"s with large FPGAs and high-speed optical fiber links. The CMS version of Apollo will be used for the track finder and the pixel readout. It features up to two large FPGAs and more than 100 optical links with speeds up to 25\,Gb/s. We study carefully the design and performance of the board b…
When an X-ray photon lands into a pixel (event pixel), the primary charge is mainly collected into the event pixel. If the X-ray landing position is sufficiently close to the pixel boundary, the primary charge spills over to the adjacent pixel forming split events. We can easily understand that there are three parameters coupled together; the X-ray landing position inside the pixel, the X-ray event pattern and the primary charge cloud shape. We can determine any one of them from the other two parameters. Since we know the charge cloud shape using the multi-pitch mesh experiment, we can calcula…
Silicon tracking detectors can record the charge in each channel (analog or digitized) or have only binary readout (hit or no hit). While there is significant literature on the position resolution obtained from interpolation of charge measurements, a comprehensive study of the resolution obtainable with binary readout is lacking. It is commonly assumed that the binary resolution is $\text{pitch}/\sqrt{12}$, but this is generally a worst case upper limit. In this paper we study, using simulation, the best achievable resolution for minimum ionizing particles in binary readout pixels. A wide rang…
The upgrade to the High Luminosity Large Hadron Collider will pose unprecedented challenges to the tracking systems of all experiments. Recent advancement of active pixel detectors designed in CMOS processes provide attractive alternatives to the well-established hybrid design using passive sensors. This article presents studies with a high-voltage CMOS active pixel sensor designed for the ATLAS tracker upgrade. The sensor is glued to the read-out chip of the Insertable B-Layer. The device under test is structured in smaller pixels than those of the attached read-out chip with information on t…
The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to instrument the innermost region of the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. The sensors of 50-150 $μ$m thickness, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests. In particular active edge sensors have been …
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding. The SLID interconnection, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. …
A measurement has been made of the radiation damage incurred by the ATLAS Pixel Detector barrel silicon modules from the beginning of operations through the end of 2012. This translates to hadronic fluence received over the full period of operation at energies up to and including 8 TeV. The measurement is based on a per-module measurement of the silicon sensor leakage current. The results are presented as a function of integrated luminosity and compared to predictions by the Hamburg Model. This information can be used to predict limits on the lifetime of the Pixel Detector due to current, for …
We demonstrate the capabilities of a highly parallel, active pixel detector for large-area, mass spectrometric imaging of biological tissue sections. A bare Timepix assembly (512x512 pixels) is combined with chevron microchannel plates on an ion microscope matrix-assisted laser desorption time-of-flight mass spectrometer (MALDI TOF-MS). The detector assembly registers position- and time-resolved images of multiple m/z species in every measurement frame. We prove the applicability of the detection system to bio-molecular mass spectrometry imaging on biologically relevant samples by mass-resolve…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $μ$m thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices be…
We present results on the reconstructed image resolution of a position sensitive radiation instrument (COCAE) based on extensive simulation studies. The reconstructed image resolution has been investigated in a wide range of incident photon energies emitted by point-like sources located at different source-to-detector distances on and off the detector's symmetry axis. The ability of the detector to distinguish multiple radioactive sources observed simultaneously is investigating by simulating point-like sources of different energies located on and off the detector's symmetry axis and at differ…
Pixelated silicon detectors are state-of-the-art technology to achieve precise tracking and vertexing at collider experiments, designed to accurately measure the hit position of incoming particles in high rate and radiation environments. The detector requirements become extremely demanding for operation at the High-Luminosity LHC, where up to 200 interactions will overlap in the same bunch crossing on top of the process of interest. Additionally, fluences up to 2.3 10^16 cm^-2 1 MeV neutron equivalent at 3.0 cm distance from the beam are expected for an integrated luminosity of 3000 fb^-1. In …
This paper reports on the sensor R&D activity for the CMS pixel detector. Devices featuring several design and technology options have been irradiated up to a proton fluencec of 1E15 n_eq/cm**2 at the CERN PS. Afterward they were bump bonded to unirradiated readout chips and tested using high energy pions in the H2 beam line of the CERN SPS. The readout chip allows a non zero suppressed full analogue readout and therefore a good characterization of the sensors in terms of noise and charge collection properties. The position dependence of signal is presented and the differences between the two …
In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner Tracker (ITk). The use of quad chip modules is intended in its pixel region. These modules consist of a silicon sensor that forms a unit along with four read-out chips. The current ATLAS pixel detector consists of planar n-in-n silicon pixel sensors. Similar sensors and four FE-I4 read-out chips were assembled to first prototypes of planar n-in-n quad modules. Th…
The Gas Pixel Detector was designed and built as a focal plane instrument for X-ray polarimetry of celestial sources, the last unexplored subtopics of X-ray astronomy. It promises to perform detailed and sensitive measurements resolving extended sources and detecting polarization in faint sources in crowded fields at the focus of telescopes of good angular resolution. Its polarimetric and spectral capability were already studied in earlier works. Here we investigate for the first time, with both laboratory measurements and Monte Carlo simulations, its imaging properties to confirm its unique c…
Standard as well as irradiated silicon pixel detectors developed for the ATLAS experiment were tested in a beam. Digital and analog resolutions were determined comparing the positions measured by a microstrip telescope and by the pixel detector. Digital resolutions of 10 um and analog resolutions of 6 um (before irradiation) and 10 um (after irradiation) are obtained without subtracting the error on the position determined by the telescope.
The two-dimensional interpolating readout concept of the Virtual-Pixel detector (ViP detector) goes along with an enormous reduction of electronic channels compared to pure pixel devices. However, the special concept of the readout structure demands for adequate position reconstruction methods. Theoretical considerations reflecting the choice and the combination of linear algorithms with emphasis on correct position reconstruction and spatial resolution are presented. A subsequent two-dimensional coordinate transformation further improves the image response of the system. Measured images show …
The Compact Muon Solenoid (CMS) detector is one of two general-purpose detectors that measure the products of high energy particle interactions in the Large Hadron Collider (LHC) at CERN. The silicon pixel detector is the innermost component of the CMS tracking system. The detector which was in operation between 2009 and 2016 has now been replaced with an upgraded one in the beginning of 2017. During the previous shutdown period of the LHC, a prototype readout system and a third disk was inserted into the old forward pixel detector with eight prototype blades constructed using the new digital …
The development of an innovative position sensitive pixelated sensor to detect and measure with high precision the coordinates of the ionizing particles is proposed. The silicon avalanche pixel sensors (APiX) is based on the vertical integration of avalanche pixels connected in pairs and operated in coincidence in fully digital mode and with the processing electronics embedded on the chip. The APiX sensor addresses the need to minimize the material budget and related multiple scattering effects in tracking systems requiring a high spatial resolution in the presence of a large occupancy. The ex…
In this paper a detailed simulation of irradiated pixel sensors was used to investigate the effects of radiation damage on the position determination and optimize the hit reconstruction algorithms. The simulation implements a model of radiation damage by including two defect levels with opposite charge states and trapping of charge carriers. The simulation shows that a position resolution below 15 $μ$m along the CMS $r-ϕ$ plane can be achieved after an irradiation fluence of $5.9\times10^{14}$ n$_{\rm{eq}}/$cm$^2$. In addition, we show that systematic errors in the position determination can b…
