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arXiv 1906.02499cs.CRcs.ET
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3D Integration: Another Dimension Toward Hardware Security

Johann Knechtel, Satwik Patnaik, Ozgur Sinanoglu

英文摘要:

We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and "all around" shielding for 3D ICs.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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