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arXiv 1801.08233cond-mat.mtrl-scicond-mat.mes-hallphysics.comp-phquant-ph
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V族材料中应变诱导的Weyl和Dirac态及直接-间接能隙跃迁

Strain-induced Weyl and Dirac states and direct-indirect gap transitions in group-V materials

Glenn Moynihan, Stefano Sanvito, David D. O'Regan

摘要:

我们进行全面的密度泛函理论计算应变二维磷(P),砷(As)和锑(Sb)在单层,双层,和散装$α$ -阶段,从我们计算这些材料的关键机械和电子性能。具体来说,我们计算它们的电子能带结构,带隙和电荷载流子的有效质量,并确定可能发生的定性电子和结构转变。此外,我们计算的弹性性能,如杨氏模量$Y$ ;剪切模量$G$ ;体积模量$\mathcal{B}$ ;和泊松比$ν$,并提出其各向同性的平均值,以及它们的依赖于面内取向,推导出相关的表达式。我们预测了应变诱导狄拉克态在单层的As和Sb和双层的P,As,Sb,以及可能存在的Weyl态在体相的P和As。预测这些相支持高达$10^6$ ~ $\textrm{ms}^{-1}$的电荷速度,并且在一些高度各向异性的情况下,允许在起皱方向上的一维弹道电导率。我们还预测了许多带隙转变为温和的面内应力。我们的研究结果有助于安装这些材料的效用的证据,使其广泛的可调性能,并促进其在下一代电子产品的潜在应用的直接探索。

英文摘要:

We perform comprehensive density-functional theory calculations on strained two-dimensional phosphorus (P), arsenic (As) and antimony (Sb) in the monolayer, bilayer, and bulk $α$-phase, from which we compute the key mechanical and electronic properties of these materials. Specifically, we compute their electronic band structures, band gaps, and charge-carrier effective masses, and identify the qualitative electronic and structural transitions that may occur. Moreover, we compute the elastic properties such as the Young's modulus $Y$; shear modulus $G$; bulk modulus $\mathcal{B}$; and Poisson ratio $ν$ and present their isotropic averages of as well as their dependence on the in-plane orientation, for which the relevant expressions are derived. We predict strain-induced Dirac states in the monolayers of As and Sb and the bilayers of P, As, and Sb, as well as the possible existence of Weyl states in the bulk phases of P and As. These phases are predicted to support charge velocities up to $10^6$~$\textrm{ms}^{-1}$ and, in some highly anisotropic cases, permit one-dimensional ballistic conductivity in the puckered direction. We also predict numerous band gap transitions for moderate in-plane stresses. Our results contribute to the mounting evidence for the utility of these materials, made possible by their broad range in tuneable properties, and facilitate the directed exploration of their potential application in next-generation electronics.

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