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arXiv 1608.04715cond-mat.mtrl-sci
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III-V半导体氮化物的正交和非正交紧束缚参数

Orthogonal and Non-Orthogonal Tight Binding parameters for III-V Semiconductors Nitrides

A. S. Martins, C. E. Fellows

摘要:

采用模拟退火(SA)方法确定了氮化物半导体AlN、GAN和InN的不同紧束缚(TB)参数集,并讨论了它们的局限性和潜力。考虑了两种原子基组:(\textit{i})正交的$sp^3s*$,其相互作用可达第二邻元;(\textit{ii})非正交的$spd$,其哈密顿矩阵元在扩展休克尔理论(EHT)中计算.对于非正交方法,TB参数给出了锌合金和纤锌矿晶体结构。

英文摘要:

A simulated annealing (SA) approach is employed in the determination of different tight binding (TB) sets of parameters for the nitride semiconductors AlN, GaN and InN, as well their limitations and potentialities are also discussed. Two kinds of atomic basis set are considered: (\textit{i}) the orthogonal $sp^3s*$ with interaction up to second neighbors and (\textit{ii}) a $spd$ non-orthogonal set, with the Hamiltonian matrix elements calculated within the Extended Hückel Theory (EHT) prescriptions. For the non-orthogonal method, TB parameters are given for both zincblend and wurtzite crystalline structures.

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