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arXiv 1607.06131cond-mat.mes-hall
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拓扑绝缘体互连的性能

Performance of Topological Insulator Interconnects

Timothy M. Philip, Mark R. Hirsbrunner, Moon Jip Park, Matthew J. Gilbert

摘要:

铜互连在纳米尺度下的不良性能要求用于集成电路的持续缩放的新材料解决方案。我们建议使用三维时间反演不变的拓扑绝缘体(TI),主机背散射保护的表面状态,为此目的。使用半经典方法,我们证明了纳米级TI互连具有比纳米级铜互连和石墨烯纳米带低1-3个数量级的电阻。我们使用非平衡格林函数(NEGF)的形式主义来测量的纳米TI和金属互连线的杂质无序的存在下所造成的电导的变化。我们发现,金属互连遭受的电阻增加,相对于清洁的限制,超过500%,由于无序,而TI的表面状态增加不到35%,在同一制度。

英文摘要:

The poor performance of copper interconnects at the nanometer scale calls for new material solutions for continued scaling of integrated circuits. We propose the use of three dimensional time-reversal-invariant topological insulators (TIs), which host backscattering-protected surface states, for this purpose. Using semiclassical methods, we demonstrate that nanoscale TI interconnects have a resistance 1-3 orders of magnitude lower than copper interconnects and graphene nanoribbons at the nanometer scale. We use the nonequilibrium Green function (NEGF) formalism to measure the change in conductance of nanoscale TI and metal interconnects caused by the presence of impurity disorder. We show that metal interconnects suffer a resistance increase, relative to the clean limit, in excess of 500% due to disorder while the TI's surface states increase less than 35% in the same regime.

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