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arXiv 1503.05086cond-mat.mes-hall
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超高电子迁移率器件的机械倒装

Mechanical Flip-Chip for Ultra-High Electron Mobility Devices

K. Bennaceur, B. A. Schmidt, S. Gaucher, D. Laroche, M. P. Lilly, J. L. Reno, K. W. West, L. N. Pfeiffer, G. Gervais

摘要:

静电门对于基于高迁移率二维电子气(2DEG)的器件的物理学是至关重要的,因为它们允许在选定区域中耗尽电子。这种场效应选通使得能够制造各种各样的器件,例如量子点接触(QPC)、电子干涉仪和量子点。为了制造这些栅极,通常在2DEG材料上进行处理,这在许多情况下对其电子迁移率有害。在这里,我们提出了一种替代工艺,除了欧姆接触之外,该工艺不需要对2DEG材料进行任何处理。这种方法依赖于处理单独的晶片,然后以倒装芯片方式将其机械安装在2DEG材料上。这种技术被证明是成功的GaAs/AlGaAs材料上的量子点接触与中等和超高的电子迁移率。

英文摘要:

Electrostatic gates are of paramount importance for the physics of devices based on high-mobility two-dimensional electron gas (2DEG) since they allow depletion of electrons in selected areas. This field-effect gating enables the fabrication of a wide range of devices such as, for example, quantum point contacts (QPC), electron interferometers and quantum dots. To fabricate these gates, processing is usually performed on the 2DEG material, which is in many cases detrimental to its electron mobility. Here we propose an alternative process which does not require any processing of the 2DEG material other than for the ohmic contacts. This approach relies on processing a separate wafer that is then mechanically mounted on the 2DEG material in a flip-chip fashion. This technique proved successful to fabricate quantum point contacts on both GaAs/AlGaAs materials with both moderate and ultra-high electron mobility.

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