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arXiv 1402.3446cond-mat.mtrl-sci
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用化学机械抛光法抛光{100}和{111}单晶金刚石

Polishing of {100} and {111} single crystal diamond through the use of Chemical Mechanical Polishing

Evan L. H. Thomas, Soumen Mandal, Emmanuel B. Brousseau, Oliver A. Williams

摘要:

金刚石是最硬和最难抛光的材料之一。在本文中,抛光的{111}和{100}单晶金刚石表面的标准化学机械抛光,在硅工业中使用,是证明。使用具有Logitech SF 1 Syton和聚氨酯/聚酯抛光垫的Logitech Tribo化学机械抛光系统。观察到{100}和{111}样品的粗糙度分别从0.92 nm均方根(RMS)降低至0.23 nm和从0.31 nm RMS降低至0.09 nm。

英文摘要:

Diamond is one of the hardest and most difficult to polish materials. In this paper, the polishing of {111} and {100} single crystal diamond surfaces by standard Chemical Mechanical Polishing, as used in the silicon industry, is demonstrated. A Logitech Tribo Chemical Mechanical Polishing system with Logitech SF1 Syton and a polyurethane/polyester polishing pad was used. A reduction in roughness from 0.92 to 0.23 nm root mean square (RMS) and 0.31 to 0.09 nm RMS for {100} and {111} samples respectively was observed.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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