arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 2409.06182cond-mat.mtrl-scicond-mat.softphysics.chem-ph
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温度和裂纹尖端速度对弹性固体中裂纹扩展的影响

Influence of temperature and crack-tip speed on crack propagation in elastic solids

B. N. J. Persson

AI总结:

本研究将裂纹尖端键断裂建模为应力辅助热激活过程,揭示温度降低和裂尖速度升高会增大有效裂纹扩展能,并解释其对粘合裂纹更显著,理论得到PDMS相关实验支持。

摘要:

我研究了类橡胶材料中裂纹尖端处键断裂的温度和裂纹尖端速度的影响。键断裂被视为一种应力辅助的热激活过程,并产生有效裂纹扩展能,该能量随温度降低或裂纹尖端速度增加而显著增大。这一效应对粘合(界面)裂纹扩展尤为重要,但对内聚裂纹扩展则不那么重要,因为后者的键断裂能要大得多。对于粘合裂纹,理论结果与硅酮(PDMS)橡胶接触石英玻璃表面的粘附测量结果一致。对于内聚裂纹,该理论与化学键合到硅烷化玻璃上的PDMS薄膜的实验结果吻合良好。

英文摘要:

I study the influence of temperature and the crack-tip velocity of the bond breaking at the crack tip in rubber-like materials. The bond breaking is considered as a stress-aided thermally activated process and result in an effective crack propagation energy which increases strongly with decreasing temperature or increasing crack-tip speed. This effect is particular important for adhesive (interfacial) crack propagation but less important for cohesive crack propagation owing to the much larger bond-breaking energies in the latter case. For adhesive cracks the theory results are consistent with adhesion measurements for silicone (PDMS) rubber in contact with silica glass surfaces. For cohesive cracks the theory agree well with experimental results PDMS films chemically bound to silinized glass.

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