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arXiv 2409.03224quant-ph

片上高维纠缠光子源

On chip high-dimensional entangled photon sources

Tavshabad Kaur, Daniel Peace, Jacquiline Romero

AI总结:

本文综述了片上高维纠缠光子源的非线性光学过程、材料平台、当前实现与应用,并探讨了现有挑战及混合异质集成策略的未来机遇。

摘要:

高维量子纠缠是量子通信和量子计算等新兴量子技术的重要资源。米级实验装置的可扩展性限制了体光学中的高维纠缠。量子技术的进步依赖于可重复、可重构的量子器件——包括光子源,而利用体光学以可扩展的方式实现这些器件具有挑战性。纳米技术和CMOS兼容集成技术的进步使得在毫米级芯片上产生纠缠光子成为可能,显著增强了实际量子应用中的可扩展性、稳定性、可复制性和小型化。近年来,我们看到了在多种材料平台上利用不同自由度(包括路径、频率箱、时间箱和横模)进行的若干芯片级演示。一个完整的量子光子集成电路需要产生、操控和检测qudit(高维量子态),涉及各种有源和无源量子光子组件,这进一步增加了复杂程度。在此,我们回顾并介绍了促进片上高维纠缠光子源的非线性光学过程以及当前使用的材料平台。我们讨论了一系列当前片上高维纠缠光子源的实现方式及已演示的应用。我们评论了由于各个材料平台的局限性而产生的当前挑战,并提出了面向下一代集成量子光子芯片的混合与异质集成策略的未来机遇。

英文摘要:

High-dimensional quantum entanglement is an important resource for emerging quantum technologies such as quantum communication and quantum computation. The scalability of metres-long experimental setups limits high-dimensional entanglement in bulk optics. Advancements in quantum technology hinge on reproducible, and reconfigurable quantum devices -- including photon sources, which are challenging to achieve in a scalable manner using bulk optics. Advances in nanotechnology and CMOS-compatible integration techniques have enabled the generation of entangled photons on millimeter-scale chips, significantly enhancing scalability, stability, replicability, and miniaturization for real-world quantum applications. In recent years we have seen several chip-scale demonstrations with different degrees of freedom including path, frequency-bin, time-bin, and transverse modes, on many material platforms. A complete quantum photonic integrated circuit requires the generation, manipulation, and detection of qudits, involving various active and passive quantum photonic components which further increase the degree of complexity. Here, we review and introduce the nonlinear optical processes that facilitate on-chip high-dimensional entangled photon sources and the currently used material platforms. We discuss a range of current implementations of on-chip high-dimensional entangled photon sources and demonstrated applications. We comment on the current challenges due to the limitations of individual material platforms and present future opportunities in hybrid and heterogeneous integration strategies for the next generation of integrated quantum photonic chips.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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