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arXiv 2104.04693cond-mat.mtrl-sci
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用于热管理应用的具有增强的界面热导率的半导体氮化硼-石墨烯异质结构

Hexagonal Boron Nitride-Graphene Heterostructures with Enhanced Interfacial Thermal Conductance for Thermal Management Applications

Saheb Karak, Suvodeep Paul, Devesh Negi, Bommareddy Poojitha, Saurabh Kumar Srivastav, Anindya Das, Surajit Saha

摘要:

原子级薄的石墨烯单层显示出优异的电子特性,这导致了对其在纳米器件中的应用的大量研究。然而,这种纳米器件的热管理是必不可少的,以提高其性能。据报道,与广泛使用的SiO2/Si支撑的石墨烯相比,支撑在六方氮化硼(h-BN)衬底上的石墨烯显示出增强的(光)电子和热性质。受此启发,我们对四种不同类型的(异质)结构进行了温度和功率相关的拉曼光谱测量:(a)h-BN(BN),(b)石墨烯(Gr),(c)石墨烯上的h-BN(BG),以及(d)由h-BN层从顶部和底部(BGB)封装的石墨烯,所有这些都支撑在SiO2/Si衬底上。我们已经估计了这四种(异质)结构的热导率(\k{appa})和每单位面积的界面热导率(g)的值,以证明结构-活性(热)关系。本文报道了SiO_2/Si负载的h-BN的\k{appa}和g值分别为280.0 ± 58.0 Wm ~(-1)K ~(-1)和25.6 ± 0.4 MWm ~(-2)K ~(-1)。更重要的是,我们已经观察到异质结构中的单位面积的热导率和界面热导率的改善,这确保了器件中更好的散热。观察到SiO2/Si(BGB)样品上的h-BN包封的石墨烯的\k{appa}和g分别为850.0 ± 81.0 Wm-1 K-1和105 ± 1 MWm-2K-1,而SiO2/Si基底上的石墨烯分别为600.0 ± 93.0 Wm-1 K-1和1.15 ± 0.40 MWm-2K-1。因此,我们建议,对于基于石墨烯的纳米级器件,用h-BN封装是解决热管理问题的更好替代方案。

英文摘要:

Atomically thin monolayers of graphene show excellent electronic properties which have led to a great deal of research on their use in nanoscale devices. However, heat management of such nanoscale devices is essential in order to improve their performance. Graphene supported on hexagonal boron nitride (h-BN) substrate has been reported to show enhanced (opto)electronic and thermal properties as compared to extensively used SiO2/Si supported graphene. Motivated by this, we have performed temperature- and power-dependent Raman Spectroscopic measurements on four different types of (hetero)structures: (a) h-BN (BN), (b) graphene (Gr), (c) h-BN on graphene (BG), and (d) graphene encapsulated by h-BN layers from both top and bottom (BGB), all supported on SiO2/Si substrate. We have estimated the values of thermal conductivity (\k{appa}) and interfacial thermal conductance per unit area (g) of these four (hetero)structures to demonstrate the structure-activity (thermal) relationship. We report here the values of \k{appa} and g for h-BN supported on SiO2/Si as 280.0 +-58.0 Wm-1K-1 and 25.6+-0.4 MWm-2K-1, respectively. More importantly, we have observed an improvement in both thermal conductivity and interfacial thermal conductance per unit area in the heterostructures which ensures a better heat dissipation in devices. The \k{appa} and g of h-BN encapsulated graphene on SiO2/Si (BGB) sample was observed to be 850.0+-81.0 Wm-1K-1 and 105+-1 MWm-2K-1, respectively, as opposed to 600.0+-93.0 Wm-1K-1 and 1.15+-0.40 MWm-2K-1, respectively, for graphene on SiO2/Si substrate. Therefore, we propose that for graphene-based nanoscale devices, encapsulation with h-BN is a better alternative to address heat management issues.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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