arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 2103.11573physics.app-phcond-mat.mtrl-sci
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电容式薄膜热流开关装置

Capacitor Type Thin-Film Heat Flow Switching Device

Keisuke Hirata, Takuya Matsunaga, Saurabh Singh, Masaharu Matsunami, Tsunehiro Takeuchi

摘要:

我们开发了一种电容型热流开关器件,其中电极的电子热导率通过由所施加的偏置电压改变的载流子浓度来主动控制。该器件由非晶p型Si-Ge-Au合金层、作为介质层的非晶SiO $_2$和n型Si衬底组成。这两种非晶材料的特征在于非常低的晶格热导率,小于1 Wm-1 K-1。利用分子束沉积技术在Si衬底上表面形成的100 nm厚的SiO $_2$层上沉积40 nm厚的Si-Ge-Au非晶层。偏压依赖的热导率和热流密度的制造设备进行了评估,在室温下通过时域热反射法。因此,我们观察到热导率增加了55%。

英文摘要:

We developed a capacitor type heat flow switching device, in which electron thermal conductivity of the electrodes is actively controlled through the carrier concentration varied by an applied bias voltage. The devices consist of an amorphous p-type Si-Ge-Au alloy layer, an amorphous SiO$_2$ as the dielectric layer, and a n-type Si substrate. Both amorphous materials are characterized by very low lattice thermal conductivity, less than 1 Wm-1K-1. The Si-Ge-Au amorphous layer with 40 nm in thickness was deposited by means of molecular beam deposition technique on the 100 nm thick SiO$_2$ layer formed at the top surface of Si substrate. Bias voltage-dependent thermal conductivity and heat flow density of the fabricated device were evaluated by a time-domain thermoreflectance method at room temperature. Consequently, we observed a 55 percent increase in thermal conductivity.

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