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arXiv 2102.08694astro-ph.IM
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XGIS车载仪器THESEUS:检测平面和车载电子设备

The XGIS instrument on-board THESEUS: the detection plane and on-board electronics

Fabio Fuschino, Riccardo Campana, Claudio Labanti, Lorenzo Amati, Enrico Virgilli, Luca Terenzi, Pierluigi Bellutti, Giuseppe Bertuccio, Giacomo Borghi, Frances… 展开作者

Fabio Fuschino, Riccardo Campana, Claudio Labanti, Lorenzo Amati, Enrico Virgilli, Luca Terenzi, Pierluigi Bellutti, Giuseppe Bertuccio, Giacomo Borghi, Francesco Ficorella, Massimo Gandola, Marco Grassi, Giovanni La Rosa, Paolo Lorenzi, Piero Malcovati, Filippo Mele, Piotr Orleański, Antonino Picciotto, Alexandre Rachevski, Irina Rashevskaya, Andrea Santangelo, Paolo Sarra, Giuseppe Sottile, Christoph Tenzer, Andrea Vacchi, Zampa Gianluigi, Nicola Zampa, Nicola Zorzi, Paul hedderman, M. Winkler, Alessandro Gemelli, Ifran Kuvvetli, Søren Møller Pedersen, Denis Tcherniak, Lucas Christoffer Bune Jensen

摘要:

THESEUS飞行任务(由欧空局在目前处于A阶段的宇宙视野M5发射机会框架内选定)上的X和伽马成像光谱仪仪器是以由数千个单个有源元件组成的探测平面为基础的。每个元件包括一个4.5x4.5x30 mm 3 CsI(Tl)闪烁体棒,两端与硅漂移探测器(SDD)光学耦合。SDD既充当闪烁光的光电探测器,又充当直接X射线传感器。本文回顾了XGIS探测飞机的设计,概述了系统模块化和冗余方面的战略选择。还描述了检测器电子原型的结果。此外,低噪声前端电子的设计和开发,强调创新的架构设计的基础上定制设计的专用集成电路(ASIC)。

英文摘要:

The X and Gamma Imaging Spectrometer instrument on-board the THESEUS mission (selected by ESA in the framework of the Cosmic Vision M5 launch opportunity, currently in phase A) is based on a detection plane composed of several thousands of single active elements. Each element comprises a 4.5x4.5x30 mm 3 CsI(Tl) scintillator bar, optically coupled at both ends to Silicon Drift Detectors (SDDs). The SDDs acts both as photodetectors for the scintillation light and as direct X-ray sensors. In this paper the design of the XGIS detection plane is reviewed, outlining the strategic choices in terms of modularity and redundancy of the system. Results on detector-electronics prototypes are also described. Moreover, the design and development of the low-noise front-end electronics is presented, emphasizing the innovative architectural design based on custom-designed Application-Specific Integrated Circuits (ASICs).

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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