声流器件中换能器与芯片耦合层的数值研究
Numerical study of the coupling layer between transducer and chip in acoustofluidic devices
摘要：
本文对超声声流器件中换能器与微流控芯片之间的耦合层进行了二维和三维的数值模拟研究。该模型包括带有电极的传感器、带有充液微通道的微流控芯片以及传感器和芯片之间的耦合层。我们考虑两种常用的耦合材料，固体环氧胶和粘性甘油，以及两种常用的设备类型，玻璃毛细管和硅玻璃芯片。我们研究如何在理想的设备中没有耦合层的声共振是持续或衰减的耦合层的厚度增加插入。我们建立了一个简单的标准的基础上的相位的声波是否一个给定的零层共振是持续或衰减的耦合层。最后，我们表明，通过控制的厚度和材料，耦合层可以用作一个设计组件的最佳和强大的声流体共振。
英文摘要：
We study by numerical simulation in two and three dimensions the coupling layer between the transducer and the microfluidic chip in ultrasound acoustofluidic devices. The model includes the transducer with electrodes, the microfluidic chip with a liquid-filled microchannel, and the coupling layer between the transducer and the chip. We consider two commonly used coupling materials, solid epoxy glue and viscous glycerol, as well as two commonly used device types, glass capillary tubes and silicon-glass chips. We study how acoustic resonances in ideal devices without a coupling layer is either sustained or attenuated as a coupling layer of increasing thickness is inserted. We establish a simple criterion based on the phase of the acoustic wave for whether a given zero-layer resonance is sustained or attenuated by the addition of a coupling layer. Finally, we show that by controlling the thickness and the material, the coupling layer can be used as a design component for optimal and robust acoustofluidic resonances.
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