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arXiv 2011.07942physics.ins-det
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CuCr1Zr和AISI 316 L之间的热等静压(HIP)辅助扩散接合,用于CERN的超级质子同步加速器(SPS)内部束流收集器

Hot Isostatic Pressing (HIP) assisted diffusion bonding between CuCr1Zr and AISI 316L for application to the Super Proton Synchrotron (SPS) internal beam dump at CERN

Stefano Pianese, Antonio Perillo-Marcone, François-Xavier Nuiry, Marco Calviani, Krzysztof Adam Szczurek, Gonzalo Arnau Izquierdo, Pietro Avigni, Simon Bonnin, … 展开作者

Stefano Pianese, Antonio Perillo-Marcone, François-Xavier Nuiry, Marco Calviani, Krzysztof Adam Szczurek, Gonzalo Arnau Izquierdo, Pietro Avigni, Simon Bonnin, Josep Busom Descarrega, Thierry Feniet, Keith Kershaw, Jerome Lendaro, Ana Teresa Perez Fontenla, Thomas Schubert, Thomas Weissgärber

摘要:

欧洲核子研究中心的新一代超级质子同步加速器(SPS)的内部束流收集器必须耗散由初级质子束沉积的约270千瓦的热功率。为此,冷却系统必须具有非常有效的排热功能。通过热等静压(HIP)辅助的扩散结合被认为是连接冷却回路和转储核心材料的有前途的方法,以最大限度地提高传热效率。本文介绍了两个CuCr 1 Zr坯料封闭SS 316 L管和实现一个真正的大小原型的转储的冷却板,以及其冷却性能的评估下转储最关键的操作场景的HIP辅助扩散连接的调查。采用能谱分析、显微组织分析、热导率和机械强度测试等方法对CuCr 1 Zr-CuCr 1 Zr和CuCr 1 Zr-SS 316L热等静压扩散连接界面进行了表征。一个测试台允许评估实际尺寸原型的冷却性能。在结合界面处,观察到典型的扩散现象的存在。此外,测得的拉伸强度和热导率至少相当于组装的材料中的最低值,并且与其整体性能相当,这意味着实现了良好的粘合质量。最后,实际尺寸的原型成功地进行了测试,与特设的热测试台和最高的运行热功率预期在新一代的SPS内部束流收集器。

英文摘要:

The new generation internal beam dump of the Super Proton Synchrotron (SPS) at CERN will have to dissipate approximately 270 kW of thermal power, deposited by the primary proton beam. For this purpose, it is essential that the cooling system features a very efficient heat evacuation. Diffusion bonding assisted by Hot Isostatic Pressing (HIP) was identified as a promising method of joining the cooling circuits and the materials of the dump's core in order to maximise the heat transfer efficiency. This paper presents the investigation of HIP assisted diffusion bonding between two CuCr1Zr blanks enclosing SS 316L tubes and the realisation of a real size prototype of one of the dump's cooling plate, as well as the assessments of its cooling performance under the dumps most critical operational scenarios. Energy-dispersive X-ray (EDX) spectroscopy, microstructural analyses, measurements of thermal conductivity and mechanical strength were performed to characterize the HIP diffusion bonded interfaces (CuCr1Zr-CuCr1Zr and CuCr1Zr-SS316L). A test bench allowed to assess the cooling performance of the real size prototype. At the bonded interface, the presence of typical diffusional phenomena was observed. Moreover, measured tensile strength and thermal conductivity were at least equivalent to the lowest ones of the materials assembled and comparable to its bulk properties, meaning that a good bonding quality was achieved. Finally, the real size prototype was successfully tested with an ad-hoc thermal test bench and with the highest operational thermal power expected in the new generation SPS internal beam dump.

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