利用超短脉冲对金属薄膜进行选择性激光烧蚀
Selective laser ablation of metal thin films using ultrashort pulses
AI总结：
本研究提出利用超短脉冲结合过渡金属中间层实现金属薄膜的选择性激光烧蚀，通过高电子-声子耦合在皮秒尺度触发汽化并阻断热传导，经双温模型分析及0.2皮秒脉冲实验验证，实现基底损伤最小的微图案化去除。
摘要：
在许多微加工工艺中，例如光电器件的三维图案化以及集成电路的局部修复，都需要进行选择性薄膜去除。目前已有多种湿法或干法刻蚀方法可供使用，但激光加工是一种绿色制造工具，因为它可以通过烧蚀去除薄膜，而无需使用有毒化学品。然而，激光烧蚀会对相邻图案和下层基底造成热损伤，阻碍了其在高精度和高完整性方面的广泛应用。在此，我们利用亚皮秒持续时间的超短激光脉冲，展示了一种超快激光烧蚀机制，该机制能够实现金属薄膜的选择性去除，同时对基底的损伤最小。这种超快激光烧蚀是通过插入一层过渡金属中间层来实现的，该中间层提供高的电子-声子耦合，以在皮秒时间尺度上触发汽化。这种受控的热传递形式允许剥离金属薄膜层，同时阻止热量传导至基底。我们利用材料中电子与声子之间热传递的双温模型，对提出的选择性薄膜去除超快方案进行了分析验证。此外，通过使用0.2皮秒激光脉冲对各种应用中的金属薄膜进行微图案化，进行了实验验证。
英文摘要：
Selective thin-film removal is needed in many microfabrication processes such as 3-D patterning of optoelectronic devices and localized repairing of integrated circuits. Various wet or dry etching methods are available, but laser machining is a tool of green manufacturing as it can remove thin films by ablation without use of toxic chemicals. However, laser ablation causes thermal damage on neighboring patterns and underneath substrates, hindering its extensive use with high precision and integrity. Here, using ultrashort laser pulses of sub-picosecond duration, we demonstrate an ultrafast mechanism of laser ablation that leads to selective removal of a thin metal film with minimal damage on the substrate. The ultrafast laser ablation is accomplished with the insertion of a transition metal interlayer that offers high electron-phonon coupling to trigger vaporization in a picosecond timescale. This contained form of heat transfer permits lifting off the metal thin-film layer while blocking heat conduction to the substrate. Our ultrafast scheme of selective thin film removal is analytically validated using a two-temperature model of heat transfer between electrons and phonons in material. Further, experimental verification is made using 0.2 ps laser pulses by micropatterning metal films for various applications.
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