现代微处理器的电迁移感知体系结构
Electromigration-Aware Architecture for Modern Microprocessors
摘要：
可靠性是任何微处理器的基本要求，以保证在其生命周期内正确执行。与可靠性相关的设计规则取决于所使用的工艺技术和设备的预期工作条件。为了满足可靠性要求，先进的工艺技术（28 nm及以下）提出了极具挑战性的设计规则。这种设计的可靠性规则已成为一个主要的负担，因为它们施加的严重的物理约束的超大规模集成电路实现的流程。电迁移是影响半导体可靠性的主要因素之一。EM是管芯上导线和过孔的老化过程，由可能损坏导线并且还可能显著影响集成电路时钟频率的过大电流引起。EM对器件产生全面的全局影响，因为它影响可能驻留在标准或定制逻辑单元内部、逻辑单元之间、存储器元件内部以及互连功能块的导线内的导线。设计实现流程（合成和布局布线）目前检测违反EM可靠性规则，并试图解决这些问题。与此相反，本文提出了一种新的方法来提高这些流量使用EM感知架构。我们的研究结果表明，所提出的解决方案可以放松EM设计工作的微处理器和微处理器的寿命增加一倍以上。这项工作证明了现代微处理器的这种方法，虽然原则和想法可以适应其他情况下，以及。
英文摘要：
Reliability is a fundamental requirement in any microprocessor to guarantee correct execution over its lifetime. The design rules related to reliability depend on the process technology being used and the expected operating conditions of the device. To meet reliability requirements, advanced process technologies (28 nm and below) impose highly challenging design rules. Such design-for-reliability rules have become a major burden on the flow of VLSI implementation because of the severe physical constraints they impose. This paper focuses on electromigration (EM), which is one of the major critical factors affecting semiconductor reliability. EM is the aging process of on-die wires and vias and is induced by excessive current flow that can damage wires and may also significantly impact the integrated-circuit clock frequency. EM exerts a comprehensive global effect on devices because it impacts wires that may reside inside the standard or custom logical cells, between logical cells, inside memory elements, and within wires that interconnect functional blocks. The design-implementation flow (synthesis and place-and-route) currently detects violations of EM-reliability rules and attempts to solve them. In contrast, this paper proposes a new approach to enhance these flows by using EM-aware architecture. Our results show that the proposed solution can relax EM design efforts in microprocessors and more than double microprocessor lifetime. This work demonstrates this proposed approach for modern microprocessors, although the principals and ideas can be adapted to other cases as well.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
